AS8506 datasheet(9/89 Pages) AMSCO

9 / 89 page

ams Datasheet, Confidential:2013-Sep [1-00]

AS8506 – 9

Abs o lute M a ximum R a tings

Note(s) and/or Footnote(s):

1. Human body model: R = 1.5k

Ω; C = 100pF.

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-hermetic Solid State Surface Mount Devices”.

Electrostatic Discharge

ESD

Electrostatic

discharge voltage

AEC - Q100-002

HBM standard (1)

±2

VSUP, VREF_IN, SDI, SDO,

CS, SCLK, CELL_THU,

CELL_THL, TEMP_IN1,

TEMP_IN2, REF_T, V5V,

V5V_IN, MS_SL, VREF_H,

NC_T

±4

GND, C-GND, CELL1 –

CELL7 (Cell-voltage pins,),

TSECH, TSECL, TRIG_IN,

TRIG_OUT, CLK_IN,

CLK_OUT, CVT_NOK_IN,

CVT_NOK_OUT,

WAKE_IN, WAKE_OUT,

FD_IN, FD_OUT, BD_IN

and BD_OUT

Continuous Power Dissipation

Ptot

Maximum power

dissipation

Temperature Ranges and Storage Conditions

Tstg

Storage temperature

-55

150

ºC

Rthj_36

Thermal resistance

package

ºC/W

TBODY

Package body

temperature

260

ºC

Norm: IPC/JEDEC

J-STD-020 (2)

MSL

Moisture Sensitive

Level

Symbol

Parameter

Min

Typ

Max

Units

Comments

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