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335 Folha de dados(PDF) 64 Page - Intel Corporation

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Descrição Electrónicos  Celeron D Processor
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Fabricante Electrônico  INTEL [Intel Corporation]
Página de início  http://www.intel.com
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335 Folha de dados(HTML) 64 Page - Intel Corporation

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Datasheet
Thermal Specifications and Design Considerations
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal
Monitor feature must be enabled for the processor to remain within specification.
5.1.2
Thermal Metrology
The maximum and minimum case temperatures (TC) are specified in Table 5-1. These temperature
specifications are meant to help ensure proper operation of the processor. Figure 5-1 illustrates
where Intel recommends TC thermal measurements should be made. For detailed guidelines on
temperature measurement methodology, refer to the applicable thermal design guide.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal Design
Power (W)
Minimum TC
(°C)
Maximum TC
(°C)
Notes1,2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The
TDP is not the maximum power that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may
have a lower TDP.
350
3.20
73
5
67
345
3.06
73
5
67
340
2.93
73
5
67
335
2.80
73
5
67
330
2.66
73
5
67
325
2.53
73
5
67
320
2.40
73
5
67
Figure 5-1. Case Temperature (TC) Measurement Location
31 mm x 31 mm IHS [1.22 x 1.22 in]
35 mm x 35 mm substrate [1.378 in x 1.378 in]
Measure T
C at this point
(geometric center of IHS)
Measure from edge of processor IHS
15.5 mm [0.61 in]
15.5 mm [0.61 in]



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