335 datasheet(3/82 Pages) INTEL

3 / 82 page

Datasheet

Contents

Introduction ................................................................................................................11

1.1

Terminology......................................................................................................... 11

1.1.1

Processor Packaging Terminology......................................................... 12

1.2

References .......................................................................................................... 13

Electrical Specifications........................................................................................15

2.1

FSB and GTLREF ...............................................................................................15

2.2

Power and Ground Pins ...................................................................................... 15

2.3

Decoupling Guidelines ........................................................................................ 15

2.3.1

VCC Decoupling......................................................................................16

2.3.2

FSB GTL+ Decoupling ........................................................................... 16

2.3.3

FSB Clock (BCLK[1:0]) and Processor Clocking.................................... 16

2.4

Voltage Identification ........................................................................................... 17

2.4.1

Phase Lock Loop (PLL) Power and Filter............................................... 18

2.5

Reserved, Unused, and TESTHI Pins................................................................. 19

2.6

FSB Signal Groups.............................................................................................. 20

2.7

Asynchronous GTL+ Signals............................................................................... 21

2.8

Test Access Port (TAP) Connection.................................................................... 21

2.9

FSB Frequency Select Signals (BSEL[1:0]) ........................................................ 22

2.10

Absolute Maximum and Minimum Ratings .......................................................... 22

2.11

Processor DC Specifications............................................................................... 23

2.12

VCC Overshoot Specification...............................................................................28

2.12.1 Die Voltage Validation ............................................................................29

2.13

GTL+ FSB Specifications .................................................................................... 30

Package Mechanical Specifications.................................................................31

3.1

Package Mechanical Drawing ............................................................................. 31

3.2

Processor Component Keep-Out Zones ............................................................. 34

3.3

Package Loading Specifications ......................................................................... 34

3.4

Package Handling Guidelines ............................................................................. 35

3.5

Package Insertion Specifications ........................................................................ 35

3.6

Processor Mass Specification ............................................................................. 35

3.7

Processor Materials............................................................................................. 35

3.8

Processor Markings............................................................................................. 36

3.9

Processor Pinout Coordinates............................................................................. 37

Pin Listing and Signal Descriptions.................................................................39

4.1

Processor Pin Assignments ................................................................................ 39

4.2

Alphabetical Signals Reference .......................................................................... 54

Thermal Specifications and Design Considerations .................................63

5.1

Processor Thermal Specifications....................................................................... 63

5.1.1

Thermal Specifications ........................................................................... 63

5.1.2

Thermal Metrology ................................................................................. 64

5.2

Processor Thermal Features............................................................................... 65

5.2.1

Thermal Monitor ..................................................................................... 65

5.2.2

On-Demand Mode ..................................................................................65

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