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UJA1075TW/5V0/WD Folha de dados(PDF) 30 Page - NXP Semiconductors |
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UJA1075TW/5V0/WD Folha de dados(HTML) 30 Page - NXP Semiconductors |
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30 / 53 page  UJA1075_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 — 27 May 2010 30 of 53 NXP Semiconductors UJA1075 High-speed CAN/LIN core system basis chip 8. Thermal characteristics Layout conditions for Rth(j-a) measurements: board finish thickness 1.6 mm ±10 %, double-layer board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm. Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see Figure 14). Fig 13. HTSSOP PCB PCB copper area: (bottom layer) 2 cm2 PCB copper area: (bottom layer) 8 cm2 015aaa137 optional heatsink top layer optional heatsink top layer optional heatsink top layer |
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