29 / 32 page
CY8CTST110
Document Number: 001-46931 Rev. *B
Page 29 of 32
Figure 13. 56-Pin (300-Mil) SSOP
Thermal Impedances
Solder Reflow Peak Temperature
Table 35 illustrates the minimum solder reflow peak temperature to achieve good solderability.
51-85062 *C
Table 34. Thermal Impedances per Package
Package
Typical
θ
JA
[22]
Typical
θ
JC
32 QFN[23] 5x5 mm 0.93 MAX
22 oC/W
12 oC/W
Table 35. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature[24]
Maximum Peak Temperature
32 QFN
240 oC
260 oC
Notes
22. TJ = TA + Power x θJA.
23. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
24. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
[+] Feedback
Portuguese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
