S32K310 datasheet(21/164 Pages) NXP

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Table 3. Operating Conditions...continued

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

VGPIO

Input voltage range

at any I/O or analog

pin [1][7]

-0.3

—

VDD_HV

_A/B +

0.3

—

VODPU

Open-drain pull-up

voltage [1][8]

—

VDD_HV

_A/B

—

IINJPAD_DC_OP

Continuous DC input

current (positive/

negative) that can be

injected into an I/O

pin [9]

-3

—

VDD_HV_A >= 3.6V

—

IINJPAD_DC_OP

Continuous DC input

current (positive/

negative) that can be

injected into an I/O

pin [9]

-2

—

VDD_HV_A >= 2.97V

—

IINJSUM_DC_OP

Sum of

absolute value of

injected currents

on all the I/O

pins (continuous

DC limit) [9][10]

-30

—

VDD_HV_A >= 3.6V

—

IINJSUM_DC_OP

Sum of

absolute value of

injected currents

on all the I/O

pins (continuous

DC limit) [9][10]

-20

—

VDD_HV_A >= 2.97V

—

Vramp_slow

Supply ramp rate

(slow) [1][11]

0.5

—

V/min

—

Vramp_fast

Supply ramp rate

(fast) [1][11]

—

100

V/ms

—

[1] All voltages are referred to VSS unless otherwise specified.

[2] Voltage at VDD_DCDC cannot be higher than VDD_HV_A.

[3] Min and Max values are applicable only for non-SMPS mode where V15 is sourced externally.

[4] If total power dissipation and maximum junction temperature allows. Please refer to Thermal operating characteristics table for the maximum junction

temperature, and Thermal characteristics table for the thermal characteristics, to determine the maximum power dissipation allowed for a given package.

[5] You must ensure that the junction temperature in the application must not exceed the maximum specified Tj.

[6] VREFH should always be equal to or less than VDD_HV_A +0.1. Any positive differential voltage between VREFH and VDD_HV_A i.e., VDD_HV_A < VREFH

<= VDD_HV_A + 0.1V) is for RF-AC only. Appropriate decoupling capacitors should be used to filter noise on the supplies. See application note AN5032 for

reference supply design for SAR ADC

[7] Keeping the input voltage between this range practically ensures that no (noticeable) current is being injected. When exceeding these limits, the current being

injected must be lower than IINJPAD_DC_OP, all the time.

[8] Open-drain outputs must be pulled respectively to their supply rail (VDD_HV_A or VDD_HV_B).

[9] When the input pad voltage levels are close to VDD_HV_A (respectively to VDD_HV_B) or VSS, plus /minus the forward voltage of ESD diodes, practically,

no current is being injected. When these limits are exceeded, the maximum input current spec must be honored. Refer to the S32K3 Hardware Design

Guidelines AN for more details and recommendations for protecting the devices against injection current.

[10] If a positive injection current is present in one or more I/O pins, and the device is in Low-Speed RUN or STANDBY mode, the VDD_HV_A (or respectively,

VDD_HV_B) may lift and cause unexpected behavior. Therefore, it is recommended to add external protection hardware, to safely cover this scenario.

[11] The MCU supply ramp rate parameter must be applicable to the MCU input/external supplies. The ramp rate assumes that the S32K3xx HW design

guidelines available on www.nxp.com are followed.

NXP Semiconductors

S32K3XX

S32K3xx Data Sheet

S32K3XX

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 13 — 12 November 2025

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