HCF1305-2R2-R datasheet(33/39 Pages) MICROCHIP

33 / 39 page

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2025-2026 Microchip Technology Inc. and its subsidiaries

DS20007043B-page 33

MIC24054

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Length

Contact Pitch

MILLIMETERS

0.65 BSC

MIN

MAX

NOM

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Center Pad Width

3.70

Center Pad Width

2.20

Center Pad Width

0.90

1.60

2.83

Dimension Limits

Units

Contact Pad Spacing

MILLIMETERS

MIN

MAX

5.80

Contact Pad Length

Contact Pad Width

0.40

0.30

NOM

Contact Pad Spacing

4.80

Contact Pad to Contact Pad

0.35

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

Contact Pad to Center Pad

0.12

Center Pad Length

ØV

Contact Pad to Center Pad

0.60

Center Pad to Center Pad

0.35

Center Pad to Center Pad

0.13

Contact Pad to Center Pad

0.35

SILK SCREEN

28-Lead Very Thin Plastic Quad Flat, No Lead Package (PKA) - 5x6x0.9 mm Body [VQFN]

With Multiple Exposed Pads and Fused Terminals; Micrel Legacy QFN56-28LD-PL-1

Microchip Technology Drawing C04-3120 Rev A

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