TMS320VC33 datasheet(24/59 Pages) TI2

24 / 59 page

TMS320VC33

DIGITAL SIGNAL PROCESSOR

SPRS087E -- FEBRUARY 1999 -- REVISED JANUARY 2004

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251--1443

device and development support tool nomenclature (continued)

PREFIX

TMS

320

VC 33 PGE

TMX = experimental device

TMP = prototype device

TMS = qualified device

SMJ = MIL-PRF-38535

SM = High Rel (non-38535)

DEVICE FAMILY

320 = TMS320 Family

TECHNOLOGY

PACKAGE TYPE†

= plastic DIP

J= ceramic DIP

= ceramic DIP side-brazed

GB = ceramic PGA

= ceramic CC

FN = plastic leaded CC

FD = ceramic leadless CC

= 100-pin plastic EIAJ QFP

= 100-pin plastic LQFP

PBK = 128-pin plastic LQFP

PQ = 132-pin plastic bumpered QFP

PGE = 144-pin plastic LQFP

GGU = 144-pin MicroStar BGA™

PGF = 176-pin plastic LQFP

GGW= 176-pin MicroStar BGA

C= CMOS

E = CMOS EPROM

F = CMOS Flash EEPROM

LC = Low-Voltage CMOS (3.3 V)

VC= Low-Voltage CMOS [3 V (2.5 V

or 1.8 V core)]

UC= Ultra Low-Voltage CMOS [1.8 V

(1.5 V core)]

DEVICE

1x DSP = TMS320C1x DSP Generation

2x DSP = TMS320C2x DSP Generation

3x DSP = TMS320C3x DSP Generation

4x DSP = TMS320C4x DSP Generation

5x DSP = TMS320C5x DSP Generation

54x DSP = TMS320C54x DSP Generation

6x DSP = TMS320C6x DSP Generation

† DIP = Dual-In-Line Package

PGA = Pin Grid Array

CC = Chip Carrier

QFP = Quad Flat Package

LQFP = Low-Profile Quad Flat Package

BGA = Ball Grid Array

120

SPEED

120 = 120 MFLOPS

150 = 150 MFLOPS

Figure 14. TMS320™ DSP Device Nomenclature

MicroStar BGA is a trademark of Texas Instruments.

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