UCD3138RMHT datasheet(5/99 Pages) TI2

5 / 99 page

Changes from Revision G (September 2016) to Revision H (October 2016)

Page

• Added PACKAGE DRAWING column to the Device Information table. .............................................................2

• Changed Note 2 from "Recommended for new 40-pin designs with advance BLR performance" to

"Recommended for new 40-pin designs, optimized for improved performance under temperature cycling test

for board level reliability (BLR)." ........................................................................................................................ 2

• Deleted Figure 7-3 note, "These features help to improve solder-joint reliability". ............................................ 9

Changes from Revision F (November 2013) to Revision G (September 2016)

Page

• Added Device and Documentation Support section and ESD Ratings table......................................................2

• Changed document flow to match UCD3138A................................................................................................... 2

• Added RJA package to Features and the Device Information table. ................................................................. 2

• Added RJA package. ......................................................................................................................................... 9

• Added the RJA package to the Thermal Information table............................................................................... 14

Changes from Revision E (August 2013) to Revision F (November 2013)

Page

• Changed Top Side Marking info from " 3138 " to " 3138RMH " in the Ordering Information table. ....................2

Changes from Revision D (August 2013) to Revision E (August 2013)

Page

• Added UCD3138RMH to Feature bullet............................................................................................................. 1

• Added RMH package pinout drawing................................................................................................................. 9

• Added RMH package thermal specifications.................................................................................................... 14

• Changed Global I/O registers ordered list, item 5 text from "Connecting pin/pins to high rail through internal

pull up resistors." to "Configuring pin/pins as open drain or push-pull (Normal)"............................................. 45

Changes from Revision C (March 2013) to Revision D (August 2013)

Page

• Changed TOPT spec to TJ in Abs Max table with MAX temp of 150°C............................................................. 14

• Added BP18 Voltage vs Temperature graphic.................................................................................................. 25

Changes from Revision B (July 2012) to Revision C (March 2013)

Page

• Deleted "JTAG Debug Port" feature bullet..........................................................................................................1

• Deleted text string "JTAG debug" from Description section................................................................................2

• Added NOTE under Functional Block Diagram.................................................................................................. 3

• Deleted "JTAG" option from Product Selection Matrix........................................................................................ 8

• Added text to Pin 54 description....................................................................................................................... 11

• Added text to Pin 35 description....................................................................................................................... 13

• Added BP18 spec to Abs Max Ratings and Recommended Operating Conditions Tables.............................. 14

• Deleted VDD specification from System Performance section of Electrical Characteristics .............................15

• Added footnote to Table 8-1 .............................................................................................................................17

• Added text string regarding front-end 2 in the Front End section .................................................................... 20

• Deleted text string reference to "JTAG port" in ARM Processor section...........................................................26

• Changed text strings in Tools and Documentation .......................................................................................... 82

• Added document to References list..................................................................................................................83

Changes from Revision A (March 2012) to Revision B (July 2012)

Page

• Added Feature bullets.........................................................................................................................................1

• Changed "Dual Edge Modulation" to "Triangular Modulation" in Features section.............................................1

• Changed "265 ksps" to "267 ksps" in Features section .....................................................................................1

• Clarified number of UARTs in Feature section....................................................................................................1

• Changed "FDPP" to "DDP" throughout...............................................................................................................2

• Changed Total GPIO pin count for the UCD3138 40-pin device from "17" to "18" in the Product Selection

Matrix table......................................................................................................................................................... 8

• Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics .........................................15

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UCD3138

SLUSAP2J – MARCH 2012 – REVISED NOVEMBER 2021

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