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ADP151 Folha de dados(PDF) 20 Page - Analog Devices |
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ADP151 Folha de dados(HTML) 20 Page - Analog Devices |
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20 / 23 page ![]() Data Sheet ADP151 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS analog.com Rev. J | 20 of 23 Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP151. However, as listed in Table 6, a point of diminishing returns is eventually reached beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and the GND pins. Place the output capacitor as close as possible to the VOUT and the GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. Figure 60. Example TSOT PCB Layout Figure 61. Example WLCSP PCB Layout Figure 62. Example LFCSP PCB Layout |
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