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ADA4870ACPZ-R7 Folha de dados(PDF) 2 Page - Analog Devices

Nome de Peças ADA4870ACPZ-R7
Descrição Electrónicos  2500 V/μs Slew Rate, High Voltage, 1 A Output Drive Amplifier
PDF  24 Pages
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADA4870ACPZ-R7 Folha de dados(HTML) 2 Page - Analog Devices

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Data Sheet
ADA4870
TABLE OF CONTENTS
analog.com
Rev. B | 2 of 24
Features................................................................ 1
Applications........................................................... 1
Functional Block Diagram......................................1
General Description...............................................1
Specifications........................................................ 3
±20 V Supply...................................................... 3
±5 V Supply........................................................ 4
Absolute Maximum Ratings...................................6
Maximum Power Dissipation.............................. 6
ESD Caution.......................................................6
Pin Configuration and Function Descriptions........ 7
Typical Performance Characteristics..................... 8
Applications Information...................................... 19
ON, Initial Power-Up, and Short-Circuit............19
Thermal Protection........................................... 19
Shutdown (SD).................................................19
Feedback Resistor Selection............................19
Capacitive Load Driving................................... 19
Heat and Thermal Management.......................20
Power Dissipation.............................................20
Safe Operating Area.........................................20
Printed Circuit Board (PCB)............................. 22
Thermal Modeling.............................................22
Heat Sink Selection..........................................22
Power Supplies and Decoupling...................... 22
Composite Amplifier......................................... 23
Outline Dimensions............................................. 24
Ordering Guide.................................................24
Evaluation Boards............................................ 24
REVISION HISTORY
10/2023—Rev. A to Rev. B
Changes to Data Sheet Title............................................................................................................................1
Changes to Features Section.......................................................................................................................... 1
Changes to Figure 1........................................................................................................................................ 1
Changes to General Description Section and Figure 2....................................................................................1
Added Note 1, Table 1..................................................................................................................................... 3
Added Note 1, Table 2..................................................................................................................................... 4
Changes to Maximum Power Dissipation Section and Table 4........................................................................6
Changes to Figure 3 and Table 5.....................................................................................................................7
Changes to Typical Performance Characteristics Section............................................................................... 8
Changes to ON, Initial Power-Up, and Short-Circuit Section.........................................................................19
Changes to Thermal Protection Section........................................................................................................ 19
Changes to Heat and Thermal Management Section....................................................................................20
Changes to Safe Operating Area Section, Figure 74, and Figure 75............................................................ 20
Changes to Printed Circuit Board (PCB) Section ..........................................................................................22
Changes to Heat Sink Selection Section....................................................................................................... 22
Changes to Table 7........................................................................................................................................22
Updated Outline Dimensions......................................................................................................................... 24
Changes to Ordering Guide........................................................................................................................... 24
Changes to Evaluation Boards...................................................................................................................... 24
8/2022—Rev. 0 to Rev. A
Change to Power Dissipation Section............................................................................................................20
5/2014—Revision 0: Initial Version



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