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S32K310 Folha de dados(PDF) 3 Page - NXP Semiconductors

Nome de Peças S32K310
Descrição Electrónicos  Supports S32K344, S32K324, S32K314, S32K312, S32K311, S32K310, S32K341, S32K342 and S32K322. Data is preliminary for S32K328, S32K338, S32K348, S32K358 and S32K388
PDF  136 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

S32K310 Folha de dados(HTML) 3 Page - NXP Semiconductors

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Contents
1
Overview............................................................ 4
2
Block diagram.....................................................4
3
Feature comparison......................................... 11
4
Ordering information.........................................16
4.1
Determining valid orderable parts ................ 16
5
General.............................................................16
5.1
Absolute maximum ratings............................17
5.2
Voltage and current operating requirements.18
5.3
Thermal operating characteristics.................20
5.4
ESD and Latch-up Protection Characteristics
...................................................................... 21
6
Power management......................................... 21
6.1
Power mode transition operating behaviors..21
6.1.1
Power mode transition operating behavior... 21
6.1.2
Boot time, HSE firmware not installed.......... 22
6.1.3
Boot time, HSE firmware installed................ 22
6.1.4
HSE firmware memory verification time
examples.......................................................23
6.2
Supply Monitoring......................................... 27
6.3
Recommended Decoupling Capacitors........ 29
6.3.1
Recommended Decoupling Capacitor diagams
...................................................................... 30
6.4
V15 regulator (SMPS option) electrical
specifications................................................ 41
6.5
V15 regulator (BJT option, NPN ballast
transistor control) electrical specifications.... 43
6.6
V11 regulator (NMOS ballast transistor control)
electrical specifications................................. 43
6.7
Supply currents............................................. 44
6.8
Operating mode............................................ 56
6.9
Cyclic wake-up current .................................58
7
I/O parameters................................................. 59
7.1
GPIO DC electrical specifications, 3.3V Range
(2.97V - 3.63V)..............................................59
7.2
GPIO DC electrical specifications, 5.0V (4.5V -
5.5V)............................................................. 62
7.3
5.0V (4.5V - 5.5V) GPIO Output AC
Specification..................................................66
7.4
3.3V (2.97V - 3.63V) GPIO Output AC
Specification..................................................68
8
Glitch Filter....................................................... 69
9
Flash memory specification..............................69
9.1
Flash memory program and erase
specifications................................................ 70
9.2
Flash memory Array Integrity and Margin Read
specifications................................................ 70
9.3
Flash memory module life specifications...... 71
9.3.1
Data retention vs program/erase cycles....... 72
9.4
Flash memory AC timing specifications........ 72
9.5
Flash memory read timing parameters......... 73
10
Analog modules................................................74
10.1
SAR ADC...................................................... 74
10.2
Supply Diagnosis.......................................... 76
10.3
Low Power Comparator (LPCMP)................ 77
10.4
Temperature Sensor..................................... 80
11
Clocking modules............................................. 81
11.1
FIRC..............................................................81
11.2
SIRC............................................................. 82
11.3
PLL................................................................82
11.4
Fast External Oscillator (FXOSC)................. 83
11.5
Slow Crystal Oscillator (SXOSC).................. 86
12
Communication interfaces................................86
12.1
LPSPI............................................................86
12.2
LPSPI0 20 MHz and 15 MHz Combinations. 91
12.3
Communication between two S32K388
devices..........................................................91
12.3.1
Timing specification for S32K388 to S32K388
communication..............................................93
12.4
I2C.................................................................93
12.5
FlexCAN characteristics................................93
12.6
SAI electrical specifications.......................... 93
12.6.1
SAI Electrical Characteristics, Slave Mode...94
12.6.2
SAI Electrical Characteristics, Master Mode.95
12.7
Ethernet characteristics................................ 96
12.7.1
Ethernet MII (10/100 Mbps).......................... 96
12.7.2
Ethernet MII (200 Mbps)............................... 98
12.7.3
Ethernet RMII (10/100 Mbps)......................100
12.7.4
Ethernet RGMII........................................... 102
12.7.5
MDIO timing specifications......................... 103
12.8
QuadSPI..................................................... 104
12.8.1
QuadSPI Quad 3.3V SDR 120MHz............ 104
12.8.2
QuadSPI Octal 3.3V DDR 100MHz............ 106
12.8.3
QuadSPI Quad 3.3V SDR 103.33MHz....... 107
12.8.4
QuadSPI Octal 3.3V DDR 120MHz............ 108
12.8.5
QuadSPI Quad 3.3V SDR 125MHz............ 109
12.9
uSDHC........................................................110
12.9.1
uSDHC SDR electrical specifications......... 110
12.9.2
uSDHC DDR electrical specifications......... 111
12.10
LPUART specifications............................... 112
13
Debug modules.............................................. 112
13.1
Debug trace timing specifications............... 112
13.2
SWD electrical specifications......................113
13.3
JTAG electrical specifications..................... 115
14
Thermal Attributes.......................................... 117
14.1
Description.................................................. 117
14.2
Thermal characteristics...............................117
15
Dimensions.....................................................120
15.1
Obtaining package dimensions...................120
16
Revision history.............................................. 120
Chapter Legal information............................................133



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