EM6607 datasheet(47/47 Pages) EMMICRO

47 / 47 page

EM6607

www.emmicroelectronic.com

21 Ordering Information

Ordering Part Number (selected examples)

Part Number

Package/Die Form

Delivery Form/ Thickness

EM6607SO28A-%%%

28 pin SOIC

Stick

EM6607SO28B-%%%

28 pin SOIC

Tape&Reel

EM6607SO24A-%%%

24 pin SOIC

Stick

EM6607SO24B-%%%

24 pin SOIC

Tape&Reel

EM6607TP28B-%%%

28 pin TSSOP

Tape&Reel

EM6607TP24B-%%%

24 pin TSSOP

Tape&Reel

EM6607WS11-%%%

Sawn wafer

11 mils

EM6607WP11-%%%

Die in waffle pack

11 mils

Please make sure to give the complete Part Number when ordering, including the 3-digit customer version. The customer

version is made of 3 numbers %%% (e.g. 008 , 012, 131, etc.)

21.1 Package Marking

24/28-pin SOIC marking:

24-pin TSSOP marking:

First line:

E M 6 6 0 7

% % % Y

E M 6

7 % %

Second line:

P P P P P P P P P P P

P P

P P P P P P

Third line:

C C C C C C C C C C C

C C C C Y P

28-pin TSSOP marking:

First line:

E M 6 6 0 7

% % % Y

Second line:

P P P P P P P P P P P

Third line:

C C C C C C C C

Where: %%% or %% = customer version, specific number given by EM (e.g. 008, 012, 131, etc.)

PP…P = Production identification (date & lot number) of EM Microelectronic

Y = year of assembly

CC…C = Customer specific package marking on third line, selected by customer

21.2 Customer Marking

There are 11 digits available for customer marking on SO24/28, 4 for TSSOP24, and 8 for TSSOP14.

EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in

the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site.

EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or

specifications detailed herein at any time without notice, and does not make any commitment to update the information

contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM

products, expressly or by implications. EM's products are not authorized for use as components in life support devices or

systems.

EM Microelectronic-Marin SA, 01/06, Rev. D

Packaged Device:

Device in DIE Form:

Package:

Die form:

SO28 = 28 pin SOIC

WW = Wafer

SO24 = 24 pin SOIC

WS = Sawn Wafer/Frame

TP28 = 28 pin TSSOP

WP = Waffle Pack

TP24 = 24 pin TSSOP

Thickness:

11 = 11 mils (280um), by default

Delivery Form:

27 = 27 mils (686um), not backlapped

A = Stick

(for other thickness, contact EM)

B = Tape&Reel

Customer Version:

customer-specific number

given by EM Microelectronic

WS 11 %%%

EM6607

EM6607 SO28 A %%%

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