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S32K310 Folha de dados(PDF) 3 Page - NXP Semiconductors |
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S32K310 Folha de dados(HTML) 3 Page - NXP Semiconductors |
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3 / 137 page ![]() Contents 1 Overview............................................................ 5 2 Block diagram.....................................................5 3 Feature comparison......................................... 12 4 Ordering information.........................................17 4.1 Determining valid orderable parts ................ 17 5 General.............................................................17 5.1 Absolute maximum ratings............................18 5.2 Voltage and current operating requirements.19 5.3 Thermal operating characteristics.................21 5.4 ESD and Latch-up Protection Characteristics ...................................................................... 22 6 Power management......................................... 22 6.1 Power management system - S32K344, S32K324, S32K341, S32K314, S32K342, and S32K322....................................................... 23 6.2 Power management system - S32K312, S32K311, S32K310...................................... 24 6.3 Power management system - S32K358, S32K348, S32K338, S32K328......................25 6.4 Power management system - S32K388....... 26 6.5 Power mode transition operating behaviors..26 6.5.1 Power mode transition operating behavior... 26 6.5.2 Boot time, HSE firmware not installed.......... 27 6.5.3 Boot time, HSE firmware installed................ 27 6.5.4 HSE firmware memory verification time examples.......................................................28 6.6 Supply Monitoring......................................... 32 6.7 Recommended Decoupling Capacitors........ 34 6.8 V15 regulator (SMPS option) electrical specifications................................................ 45 6.9 V15 regulator (BJT option, NPN ballast transistor control) electrical specifications.... 45 6.10 V11 regulator (NMOS ballast transistor control) electrical specifications................................. 46 6.11 Supply currents............................................. 47 6.12 Operating mode............................................ 66 6.13 Cyclic wake-up current .................................68 7 I/O parameters................................................. 68 7.1 GPIO DC electrical specifications, 3.3V Range (2.97V - 3.63V)..............................................68 7.2 GPIO DC electrical specifications, 5.0V (4.5V - 5.5V)............................................................. 72 7.3 5.0V (4.5V - 5.5V) GPIO Output AC Specification..................................................76 7.4 3.3V (2.97V - 3.63V) GPIO Output AC Specification..................................................77 8 Glitch Filter....................................................... 78 9 Flash memory specification..............................79 9.1 Flash memory program and erase specifications................................................ 79 9.2 Flash memory Array Integrity and Margin Read specifications................................................ 80 9.3 Flash memory module life specifications...... 81 9.3.1 Data retention vs program/erase cycles....... 81 9.4 Flash memory AC timing specifications........ 82 9.5 Flash memory read timing parameters......... 82 10 Analog modules................................................83 10.1 SAR ADC...................................................... 83 10.2 Supply Diagnosis.......................................... 86 10.3 Low Power Comparator (LPCMP)................ 86 10.4 Temperature Sensor..................................... 90 11 Clocking modules............................................. 91 11.1 FIRC..............................................................91 11.2 SIRC............................................................. 91 11.3 PLL................................................................91 11.4 Fast External Oscillator (FXOSC)................. 93 11.5 Slow Crystal Oscillator (SXOSC).................. 94 12 Communication interfaces................................95 12.1 LPSPI............................................................95 12.1.1 LPSPI............................................................95 12.1.2 LPSPI0 20 MHz and 15 MHz Combinations. 99 12.2 I2C...............................................................100 12.3 FlexCAN characteristics..............................100 12.4 SAI electrical specifications........................ 100 12.4.1 SAI Electrical Characteristics, Slave Mode.100 12.4.2 SAI Electrical Characteristics, Master Mode101 12.5 Ethernet characteristics.............................. 103 12.5.1 Ethernet MII (100 Mbps)............................. 103 12.5.2 Ethernet MII (200 Mbps)............................. 105 12.5.3 Ethernet RMII..............................................107 12.5.4 Ethernet RGMII........................................... 109 12.5.5 MDIO timing specifications......................... 110 12.6 QuadSPI..................................................... 111 12.6.1 QuadSPI Quad 3.3V SDR 120MHz............ 111 12.6.2 QuadSPI Octal 3.3V DDR 100MHz............ 113 12.6.3 QuadSPI Octal 3.3V DDR 120MHz............ 114 12.7 uSDHC........................................................115 12.7.1 uSDHC SDR electrical specifications......... 115 12.7.2 uSDHC DDR electrical specifications......... 116 12.8 LPUART specifications............................... 117 13 Debug modules.............................................. 117 13.1 Debug trace timing specifications............... 118 13.2 SWD electrical specifications......................118 13.3 JTAG electrical specifications..................... 120 14 Thermal Attributes.......................................... 122 14.1 Description.................................................. 122 14.2 Thermal characteristics...............................122 15 Dimensions.....................................................124 15.1 Obtaining package dimensions...................124 16 Revision history.............................................. 124 |
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