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S32K310 Folha de dados(PDF) 3 Page - NXP Semiconductors

Nome de Peças S32K310
Descrição Electrónicos  Supports S32K344, S32K324, S32K314, S32K312, S32K341 and S32K342. Data is preliminary for S32K311, S32K310, S32K328, S32K338, S32K348, S32K358 and S32K388
PDF  137 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

S32K310 Folha de dados(HTML) 3 Page - NXP Semiconductors

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Contents
1
Overview............................................................ 5
2
Block diagram.....................................................5
3
Feature comparison......................................... 12
4
Ordering information.........................................17
4.1
Determining valid orderable parts ................ 17
5
General.............................................................17
5.1
Absolute maximum ratings............................18
5.2
Voltage and current operating requirements.19
5.3
Thermal operating characteristics.................21
5.4
ESD and Latch-up Protection Characteristics
...................................................................... 22
6
Power management......................................... 22
6.1
Power management system - S32K344,
S32K324, S32K341, S32K314, S32K342, and
S32K322....................................................... 23
6.2
Power management system - S32K312,
S32K311, S32K310...................................... 24
6.3
Power management system - S32K358,
S32K348, S32K338, S32K328......................25
6.4
Power management system - S32K388....... 26
6.5
Power mode transition operating behaviors..26
6.5.1
Power mode transition operating behavior... 26
6.5.2
Boot time, HSE firmware not installed.......... 27
6.5.3
Boot time, HSE firmware installed................ 27
6.5.4
HSE firmware memory verification time
examples.......................................................28
6.6
Supply Monitoring......................................... 32
6.7
Recommended Decoupling Capacitors........ 34
6.8
V15 regulator (SMPS option) electrical
specifications................................................ 45
6.9
V15 regulator (BJT option, NPN ballast
transistor control) electrical specifications.... 45
6.10
V11 regulator (NMOS ballast transistor control)
electrical specifications................................. 46
6.11
Supply currents............................................. 47
6.12
Operating mode............................................ 66
6.13
Cyclic wake-up current .................................68
7
I/O parameters................................................. 68
7.1
GPIO DC electrical specifications, 3.3V Range
(2.97V - 3.63V)..............................................68
7.2
GPIO DC electrical specifications, 5.0V (4.5V -
5.5V)............................................................. 72
7.3
5.0V (4.5V - 5.5V) GPIO Output AC
Specification..................................................76
7.4
3.3V (2.97V - 3.63V) GPIO Output AC
Specification..................................................77
8
Glitch Filter....................................................... 78
9
Flash memory specification..............................79
9.1
Flash memory program and erase
specifications................................................ 79
9.2
Flash memory Array Integrity and Margin Read
specifications................................................ 80
9.3
Flash memory module life specifications...... 81
9.3.1
Data retention vs program/erase cycles....... 81
9.4
Flash memory AC timing specifications........ 82
9.5
Flash memory read timing parameters......... 82
10
Analog modules................................................83
10.1
SAR ADC...................................................... 83
10.2
Supply Diagnosis.......................................... 86
10.3
Low Power Comparator (LPCMP)................ 86
10.4
Temperature Sensor..................................... 90
11
Clocking modules............................................. 91
11.1
FIRC..............................................................91
11.2
SIRC............................................................. 91
11.3
PLL................................................................91
11.4
Fast External Oscillator (FXOSC)................. 93
11.5
Slow Crystal Oscillator (SXOSC).................. 94
12
Communication interfaces................................95
12.1
LPSPI............................................................95
12.1.1
LPSPI............................................................95
12.1.2
LPSPI0 20 MHz and 15 MHz Combinations. 99
12.2
I2C...............................................................100
12.3
FlexCAN characteristics..............................100
12.4
SAI electrical specifications........................ 100
12.4.1
SAI Electrical Characteristics, Slave Mode.100
12.4.2
SAI Electrical Characteristics, Master Mode101
12.5
Ethernet characteristics.............................. 103
12.5.1
Ethernet MII (100 Mbps)............................. 103
12.5.2
Ethernet MII (200 Mbps)............................. 105
12.5.3
Ethernet RMII..............................................107
12.5.4
Ethernet RGMII........................................... 109
12.5.5
MDIO timing specifications......................... 110
12.6
QuadSPI..................................................... 111
12.6.1
QuadSPI Quad 3.3V SDR 120MHz............ 111
12.6.2
QuadSPI Octal 3.3V DDR 100MHz............ 113
12.6.3
QuadSPI Octal 3.3V DDR 120MHz............ 114
12.7
uSDHC........................................................115
12.7.1
uSDHC SDR electrical specifications......... 115
12.7.2
uSDHC DDR electrical specifications......... 116
12.8
LPUART specifications............................... 117
13
Debug modules.............................................. 117
13.1
Debug trace timing specifications............... 118
13.2
SWD electrical specifications......................118
13.3
JTAG electrical specifications..................... 120
14
Thermal Attributes.......................................... 122
14.1
Description.................................................. 122
14.2
Thermal characteristics...............................122
15
Dimensions.....................................................124
15.1
Obtaining package dimensions...................124
16
Revision history.............................................. 124



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