MPC7410EC datasheet(50/56 Pages) NXP

50 / 56 page

MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Document Revision History

1.1

—

Internal release.

Table 12—added note 16 for ABB/AMON and DBB/DMON signal clarification.

Table 12—changed CHK note 4 reference to note 2, signal is for factory test only. Changed previous

note 4 (CHK related) to now provide additional PLL info.

Table 1—modified maximum value for OVDD from –0.3 to 3.465 to now be –0.3 to 3.6 and L2OVDD

from –0.3 to 2.6 to now be –0.3 to 2.8. Modified note 6, OVDD for revisions prior to Rev. 1.4 have

maximum value for OVDD of –0.3 to 2.8.

Table 8—removed note 12. L2_TSTCLK is for factory use only (see Table 12, note 2).

Section 1.10.2—revised section to include nomenclature tables for part markings not covered by this

spec.

Figure 2—added that under/overshoot for L2OVDD references tL2CLK while OVDD references tSYSCLK.

Table 4—added HCTE package (HX package descriptor) thermal characteristics.

Section 1.5—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages

have the same pin assignments.

Section 1.6—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages

have the same pinout listings.

Section 1.7—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages

have the same package parameters and dimensions.

Table 17—added HCTE package (HX package descriptor) to part numbering nomenclature.

Table 21—added MPC7410THXnnnLE extended temperature HCTE package part numbers and part

number specification document reference.

Table 16. Document Revision History (continued)

Revision

Date

Substantive Change(s)

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