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MPC7410EC Folha de dados(PDF) 24 Page - NXP Semiconductors |
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MPC7410EC Folha de dados(HTML) 24 Page - NXP Semiconductors |
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24 / 56 page ![]() MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 24 Freescale Semiconductor Pin Assignments 5 Pin Assignments Figure 16, part A shows the pinout for the MPC7410, 360 CBGA, 360 HCTE, and 360 HCTE Lead Free C5 Spheres packages as viewed from the top surface. Figure 16, part B shows the side profile of the CBGA and HCTE_CBGA packages to indicate the direction of the top surface view. Figure 16, part C shows the side profile of the HCTE_LGA package to indicate the direction of the top surface view. A B C D E F G H J K L M N P R T 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Not to Scale 17 18 19 U V W Part A View Part B Die Substrate Assembly Encapsulant BGA Package |
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