LT8636 datasheet(6/40 Pages) AD

6 / 40 page

LT8698S/LT8698S-1

Rev. A

For more information www.analog.com

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

1A CHARGER PROFILE

HD+ Voltage

VBUS/ISN = 5V

1.94

2.00

2.06

HD+ Output Resistance

kΩ

HD– Voltage

VBUS/ISN = 5V

2.60

2.68

2.76

HD– Output Resistance

kΩ

2A CHARGER PROFILE

HD+, HD– Voltage

VBUS/ISN = 5V

1.2

1.25

1.35

HD+, HD– Output Resistance

7.5

kΩ

ELECTRICAL CHARACTERISTICS The

denotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA = 25°C. (Note 2)

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LT8698SE and LT8698SE-1 are guaranteed to meet

performance specifications from 0˚C to 125°C junction temperature.

Specifications over the −40°C to 125°C operating junction temperature

range are assured by design, characterization and correlation with

statistical process controls. The LT8698SJ and LT8698SJ-1 are

guaranteed over the full −40°C to 150°C operating temperature range.

High junction temperatures degrade operating lifetime. Operating lifetime

is de-rated at junction temperatures greater than 125°C. The junction

temperature (TJ in °C) is calculated from the ambient temperature (TA in

°C) and power dissipation (PD in Watts) according to the formula:

TJ = TA + (PD • θJA)

where θJA (in °C/W) is the package thermal impedance.

Note 3: This IC includes overtemperature protection that is intended to

protect the device during overload conditions. Junction temperature will

exceed 150°C when overtemperature protection is active. Continuous

operation above the specified maximum operating junction temperature

will reduce lifetime.

Note 4: DUT configured in closed loop test circuit similar to page 36 CDP

charger application circuit.

Note 5: Parameter not tested in production.

Note 6: θ values are determined by simulation per JESD51 conditions,

except θJA value is determined by simulation with demo board. See

Applications Information section for more information on PCB layout

considerations and example thermal data.

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