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ADAR2001ACCZ-R7 Folha de dados(PDF) 6 Page - Analog Devices |
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ADAR2001ACCZ-R7 Folha de dados(HTML) 6 Page - Analog Devices |
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6 / 39 page ![]() ADAR2001 Data Sheet Rev. 0 | Page 6 of 39 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VPOS1, VPOS3, VPOS4, VPOS5 to GND1 +3 V, −0.3 V VPOS2 to GND1 +2.1 V, −0.3 V Digital Input to GND1 +2.1 V, −0.3 V RFIN to GND1 ±0.3 V RFIN Power −5 dBm Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 135°C Reflow Soldering Peak Temperature 260°C 1 GND is the common ground to which all GNDx pins are connected. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 4. Thermal Resistance Package Type θJA θJC Unit CC-40-71 33.8 12.2 °C/W 1 Pad soldered. ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD sensitive devices in an ESD protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002. ESD Ratings for ADAR2001 Table 5. ADAR2001, 40-Terminal LGA ESD Model Withstand Threshold (V) Class HBM 1000 to 2000 1C CDM 500 to 750 C2A ESD CAUTION |
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