BQ25708 datasheet(7/77 Pages) TI1

7 / 77 page

bq25708

www.ti.com

SLUSCU2 – NOVEMBER 2017

Product Folder Links: bq25708

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging

Section of the data book for thermal limitations and considerations of packages.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Voltage

SRN, SRP, ACN, ACP, VBUS, VSYS, BATDRV

–0.3

SW1, SW2

–2.0

BTST1, BTST2, HIDRV1, HIDRV2

–0.3

LODRV1, LODRV2 (25 ns)

–4.0

HIDRV1, HIDRV2 (25 ns)

–4.0

SW1, SW2 (25 ns)

–4.0

SDA, SCL, REGN, CHRG_OK, CELL_BATPRESZ,

ILIM_HIZ, LODRV1, LODRV2, VDDA, COMP1, COMP2,

CMPIN, CMPOUT

–0.3

PROCHOT

–0.3

5.5

IADPT, IBAT, PSYS

–0.3

3.6

Differential voltage

BTST1-SW1, BTST2-SW2, HIDRV1-SW1, HIDRV2-SW2

–0.3

SRP-SRN, ACP-ACN

–0.5

0.5

Junction temperature range, TJ

–40

155

°C

Storage temperature, Tstg

–40

155

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage

ACN, ACP, VBUS

SRN, SRP, VSYS, BATDRV

19.2

SW1, SW2

–2

BTST1, BTST2, HIDRV1, HIDRV2

SDA, SCL, REGN, CHRG_OK, CELL_BATPRESZ, ILIM_HIZ, LODRV1,

LODRV2, VDDA, COMP1, COMP2, CMPIN, CMPOUT

6.5

PROCHOT

5.3

IADPT, IBAT, PSYS

3.3

Differential

voltage

BTST1-SW1, BTST2-SW2, HIDRV1-SW1, HIDRV2-SW2

6.5

SRP-SRN, ACP-ACN

–0.35

0.35

Junction temperature, TJ

–40

125

°C

Operating free-air temperature, TA

–40

°C

BQ25708 Folha de dados(PDF) 7 Page - Texas Instruments

BQ25708 Folha de dados(HTML) 7 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77

Folha de dados Download

Ligação URL