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STPS1H100 Folha de dados(PDF) 4 Page - STMicroelectronics |
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STPS1H100 Folha de dados(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() STPS1H100 4/7 Figure 11: Forward voltage drop versus forward current (maximum values) Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1E-2 1E-1 1E+0 1E+1 2E+1 I (A) FM V (V) FM T =125°C j T =25°C j 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 30 40 50 60 70 80 90 100 110 120 130 140 S(Cu)(cm²) R (°C/W) th(j-a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 30 40 50 60 70 80 90 100 110 120 S(Cu)(cm²) R (°C/W) th(j-a) |
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