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MCP6541 Folha de dados(PDF) 13 Page - Microchip Technology

Nome de Peças MCP6541
Descrição Electrónicos  Push-Pull Output Sub-Microamp Comparators
PDF  28 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP6541 Folha de dados(HTML) 13 Page - Microchip Technology

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 2003 Microchip Technology Inc.
DS21696C-page 13
MCP6541/2/3/4
Where:
Using this simplified circuit, the trip voltage can be
calculated using the following equation:
EQUATION
Figure 2-19 and Figure 2-22 can be used to determine
typical values for VOH and VOL.
3.5
Bypass Capacitors
With this family of comparators, the power supply pin
(VDD for single supply) should have a local bypass
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good
edge rate performance.
3.6
Capacitive Loads
Reasonable capacitive loads (e.g., logic gates) have
little impact on propagation delay (see Figure 2-27).
The supply current increases with increasing toggle
frequency
(Figure 2-30),
especially
with
higher
capacitive loads.
3.7
Battery Life
In order to maximize battery life in portable
applications, use large resistors and small capacitive
loads. Also, avoid toggling the output more than
necessary and do not use chip select (CS) to conserve
power for short periods of time. Capacitive loads will
draw additional power at start-up.
3.8
PCB Surface Leakage
In applications where low input bias current is critical,
PCB (Printed Circuit Board) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012
Ω. A 5V difference would
cause 5 pA, if current-to-flow. This is greater than the
MCP6541/2/3/4 family’s bias current at 25°C (1 pA,
typ).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 3-8.
FIGURE 3-8:
Example Guard Ring Layout
for Inverting Circuit.
1.
Inverting Configuration (Figures 3-5 and 3-8):
a.
Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the
comparator (e.g., VDD/2 or ground).
b.
Connect the inverting pin (VIN–) to the input
pad without touching the guard ring.
2.
Non-inverting Configuration (Figure 3-3):
a.
Connect the non-inverting pin (VIN+) to the
input pad without touching the guard ring.
b.
Connect the guard ring to the inverting input
pin (VIN–).
R23
R2R3
R2 R3
+
------------------
=
V23
R3
R2 R3
+
------------------ V
DD
×
=
VTHL
VOH
R23
R23 RF
+
-----------------------



V23
RF
R23 RF
+
----------------------


+
=
VTLH
VOL
R23
R23 RF
+
----------------------



V23
RF
R23 RF
+
---------------------


+
=
VTLH = trip voltage from low to high
VTHL = trip voltage from high to low
Guard Ring
V
SS
VIN-VIN+



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