STM8L151F2 datasheet(57/122 Pages) STMICROELECTRONICS

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STM8L151x2, STM8L151x3

Electrical parameters

102

9.3

Operating conditions

Subject to general operating conditions for VDD and TA.

9.3.1

General operating conditions

Table 17. General operating conditions

Symbol

Parameter

Conditions

Min.

Max.

Unit

fSYSCLK

(1)

System clock

frequency

1.65 V

≤VDD < 3.6 V

MHz

VDD

Standard operating

voltage

-1.65(2)

3.6

VDDA

Analog operating

voltage

ADC1 not

used

Must be at the same

potential as VDD

1.65(2)

3.6

ADC1 used

1.8

3.6

PD(3)

Power dissipation at

TA= 85 °C for suffix 3

and suffix 6

devices

LQFP48

288

UFQFPN32

288

UFQFPN28

250

UFQFPN20

196

TSSOP20

181

Power dissipation at

TA= 125 °C for suffix 3

devices

LQFP48

UFQFPN32

185

UFQFPN28

UFQFPN20

TSSOP20

Temperature range

1.65 V

≤VDD < 3.6 V (6 suffix version)

-40

°C

1.65 V

≤VDD < 3.6 V (3 suffix version)

-40

125

Junction temperature

range

-40 °C

≤TA < 85 °C

(6 suffix version)

-40

105(4)

-40 °C

≤ TA < 125 °C

(3 suffix version)

-40

130(4)

1. fSYSCLK = fCPU

2. 1.8 V at power-up, 1.65 V at power-down if BOR is disabled

3. To calculate PDmax(TA), use the formula PDmax=(TJmax -TA)/

ΘJA with TJmax in this table and ΘJA in “Thermal characteristics”

table.

4. TJ max is given by the test limit. Above this value, the product behavior is not guaranteed.

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