© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1069_C0G_HV_HT_200C • 3/24/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Product Qualification Test Plan

Reliability/Environmental Tests per MIL–STD–202//JESD22

Load Humidity

85°C/85%RH and 200 VDC maximum, 1,000 Hours

Low Voltage Humidity

85°C/85%RH, 1.5V, 1,000 Hours

Temperature Cycling

−55°C to +200°C, 50 Cycles

Thermal Shock

−55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 Cycles

Moisture Resistance

Cycled Temp/RH 0 V, 10 cycles @ 24 hours each

Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429

Resistance to Solvents

Include Aqueous wash chemical – OKEM Clean or equivalent

Mechanical Shock and Vibration

Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes, 12 cycles

Resistance to Soldering Heat

Condition B, no per-heat of samples, Single Wave Solder

Terminal Strength

Force of 1.8 kg for 60 seconds

Board Flex

Appendix 2, Note: 3.0 mm (minimum)

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70%

relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should

be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the

time frame outlined in the table below:

Termination Finish

Storage Life

100% Matte Tin (Sn)

C

1.5 years upon receipt

SnPb (5% Pb min.)

L

1.5 years upon receipt

E

Gold (Au) 30 – 50 µin

F

1.5 years upon receipt

Gold (Au) 100 µin min.

G

1.5 years upon receipt

1

The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination

finish. For more information, see “Ordering Information” section of this document.

2

Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please

store any remaining packaged components in a dry box container to prevent oxidation of the termination finish.