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SURFACE Folha de dados, PDF

ALL 3M Electronics(9)A-BRIGHT Inc(38)Aavid, Thermal Division of Boyd Corporation(3)Abracon Corporation(131)ACCUTEK MICROCIRCUIT CORPORATION(2)Actel Corporation(1)Adam Technologies, Inc.(23)Advanced Analogic Technologies(1)Advanced Crystal Technology(198)Advanced Linear Devices(1)Advanced Photonix, Inc.(10)Advanced Power Electronics Corp.(54)Advanced Semiconductor(2)Advanced Thermal Solutions, Inc.(1)Advantech Co., Ltd.(1)AEL Crystals Ltd(1)Aeroflex Circuit Technology(1)Agilent(Hewlett-Packard)(56)AIT Components Ltd.(2)AiT Semiconductor Inc.(21)All Sensors Corporation(5)Allegro MicroSystems(10)Allied Components International(82)Alpha & Omega Semiconductors(4)Alpha Industries(15)ALPS ELECTRIC CO.,LTD.(56)America Semiconductor, LLC(1)American Accurate Components, Inc.(5)American Zettler, Inc.(1)Amphenol Corporation(17)Amphenol RF.(1)Amphenol SV Microwave(15)Anachip Corp(1)ANADIGICS, Inc(2)Analog Devices(1)Anaren Microwave(61)Anova Technologies CO., LTD.(49)Anshan Suly Electronics(1)API Delevan(106)API Technologies Corp(14)Aries Electronics, Inc.(7)Artesyn Technologies(1)ASEMI TECHNOLOGY., LTD(1)AVAGO TECHNOLOGIES LIMITED(215)AVX Corporation(16)Axiomtek Co., Ltd.(1)BaiDu Micro electrons Co., Ltd(2)Bedford Opto Technology Ltd.(5)Bel Fuse Inc.(111)Bi technologies(72)Bivar, Inc.(105)Bookham, Inc.(4)Bothhand USA, LP.(23)Bourns Electronic Solutions(180)BRIGHT LED ELECTRONICS CORP(232)Broadcom Corporation.(190)Bruckewell Technology LTD(84)Bud Industries, Inc.(1)Burland Technology Solutions(3)Bytes(19)Bytesonic Electronics Co., Ltd.(41)C&D Technologies(6)C&K Components(19)Caddock Electronics, Inc.(2)Caliber Electronics Inc.(16)California Eastern Labs(4)CAMBION Electronic Components(13)Campbell Scientific United Kingdom(1)Central Semiconductor Corp(1428)Central Technologies(2)CET Technology, LLC(2)CHENG-YI ELECTRONIC CO., LTD.(54)Chenmko Enterprise Co. Ltd.(6)Chicago Miniature Lamp,inc(7)Chip Integration Technology Corporation(221)Chongqing Pingwei Enterprise co.,Ltd(17)CIT Relay & Switch(2)Clairex Technologies, Inc(1)Coilcraft lnc.(17)Comchip Technology(50)Compact Technology Corp.(11)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(220)Continental Device India Limited(35)Cooper Bussmann, Inc.(11)Copal Electronics(20)Cornell Dubilier Electronics(7)COSMO Electronics Corporation(1)Coto Technology(7)Crane Aerospace & Electronics.(1)Crystek Corporation(1)CTS Corporation(381)CUI INC(22)Cvilux Corporation(8)Cystech Electonics Corp.(122)DACO SEMICONDUCTOR CO.,LTD.(13)DAESAN ELECTRONIC CORP.(8)Dallas Semiconductor(2)Datatronic Distribution, Inc.(4)Daya Electric Group Co., Ltd.(7)DB Lectro Inc(10)Dc Components(89)Delta Electronics, Inc.(1)Dialight Corporation(35)Dielectric Laboratories, Inc.(26)Digitron Semiconductors(1)Diode Semiconductor Korea(165)Diodes Incorporated(2379)DIOTEC Electronics Corporation(7)Diotec Semiconductor(483)Diotech Company.(92)DISCO Corporation(3)DIYI Electronic Technology Co., Ltd.(168)DOMINANT Semiconductors(182)Dongguan City Niuhang Electronics Co.LTD(5)Dongguan Pingjingsemi Technology Co., Ltd,(62)Dongguan Xinkang Electronic Technology Co., Ltd.(5)DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD(463)Dubilier(24)E&E Magnetic Products Limited(2)E-CMOS Corporation(23)E-SWITCH(1)E-Tech Electronics LTD(9)Eaton All Rights Reserved.(18)Ecliptek Corporation(13)ECM Electronics Limited.(37)ECS, Inc.(1)EIC discrete Semiconductors(173)Electronic devices inc.(2)Entegris, Inc(2)EPCOS(2)Epson Company(1)Etron Technology, Inc.(1)EUROQUARTZ limited(12)Everlight Electronics Co., Ltd(63)Excelics Semiconductor, Inc.(33)Extech Instruments Corporation.(2)
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Palavra-chave pesquisada : 'SURFACE' - Total: 42255 (1/2113) Pages
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Anaren Microwave
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Surface Mountable

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O que é SURFACE


Superfície pode ser usado de várias maneiras em componentes eletrônicos.

Primeiro, Surface Mount Technology (SMT) é um dos métodos de instalação para componentes eletrônicos.

O SMT refere -se a uma tecnologia que conecta diretamente os componentes eletrônicos à superfície de uma placa de circuito impresso (PCB).

Portanto, a superfície refere -se à superfície do PCB ao qual os componentes eletrônicos estão conectados.

Segundo, o dispositivo de montagem em superfície (SMD) refere -se a componentes eletrônicos feitos com a tecnologia SMT.

Os SMDs são projetados para serem menores, mais baratos e com densidades mais altas que os componentes tradicionais não superficiais.

Esses SMDs são amplamente utilizados em dispositivos móveis, computadores, câmeras digitais etc.

Terceiro, acabamento superficial significa a tecnologia de tratamento de superfície da PCB. Como a superfície de uma PCB pode ser danificada por corrosão, oxidação, impressão etc., várias técnicas de tratamento de superfície são usadas para protegê -la.

Essas tecnologias de tratamento de superfície desempenham um papel importante na melhoria do desempenho e da vida útil dos PCBs.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


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