9

99

Surface Mount Plastic PIN Diodes

Rev. V22

SMPP Series

9

9

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9

Mounting Information

The illustration indicates the recommended

mounting pad configuration for the SOT-23,

SOT-323 , SOD-323, SOT-143, and SC-79

packages. Solder paste containing flux should be

screened onto the pads to a thickness of 0.005-

0.007 inches. The plastic package is placed in

position, firmly adhering to the solder paste.

Permanent attachment is performed by a reflow

soldering procedure during which the tab

temperature does not exceed +275

C and the

body temperature does not exceed +250

C, for

standard models and +260

C for the RoHS

compliant devices.

Please refer to Application Note M538 for

surface mounting instructions.

0.75

1.9

.037

0.95

.035

0.90

.090

2.2

.030

0.80

inches

mm

Dimenstions:

min.

min.

SOT-23

SOT-323

0.030

0.80

0.030

0.80

0.030

0.80

0.075

1.9

0.030

0.80

inches

mm

Dimenstions:

0.030

0.80

.090

2.2

0.030

0.80

inches

mm

Dimenstions:

0.030

0.80

SOT-143

0.035

0.89

0.115

2.92

0.045

1.17

0.045

1.14

0.030

0.76

inches

mm

Dimenstions:

0.045

1.14

0.106

2.69

0.031

0.79

SC-79

0.020

0.50

0.053

1.35

inches

mm

Dimenstions:

0.020

0.50

SOD-323