Termination pad characteristics

Terminal pad materials

Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper

Terminal pad solderability

Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Thermal Derating Curve

Typical Time-To-Trip At 25°C

Recommended Solder Reflow Conditions

Soldering

‧Recommended reflow methods：IR, vapor phase oven, hot air oven.

‧Devices are not designed to be wave soldered to the bottom side

of the board.

‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).

‧Devices can be cleaned using standard method and solvents.

Note：If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

mSMD

Cooling

Derating Curves for mSMD Series

0

20

40

60

80

100

120

140

160

-40

-20

0

20

40

60

80

Temperature (°C)

60-120

sec.

120

sec.

30-60

sec.

300

200

160

0

250

190

100

Average Time Current Curves

0.001

0.01

0.1

1

10

100

0.1

1

10

100

Current In Amperes

0.10A

0.14A

0.20A

0.30A

0.50A

0.75A

1.10A

1.25A

1.50A

2.00A

2.50A

2.60A

Package Information

Reel:

MSM010～350

1500pcs／ｒｅｅｌ

PPTC/MSM Series

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