Surface Mount Resettable PTCs

Revision September 12, 2013

2 / 4

@ SOCAY Electronics Co., Ltd. 2013

Specifications are subject to change without notice.

Please refer to www.socay.com for current information.

SCF0603 Series

SOCAY Electronics Co., Ltd.

www.socay.com

Profile Feature

Pb-Free Assembly

3

°C/second max.

Preheat :

150

°C

200

°C

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

217

°C

60-150 seconds

260

°C

Time within 5

°C of actual peak:

Temperature

20-40 seconds

Ramp-down Rate:

6

°C/ second max.

Time 25

°C to Peak Temperature

8 minutes max.

Note: All temperatures refer to of the package, measured on the package body surface.

Solder reflow

Due to

“Lead Free” nature, Temperature and Dwelling time for the

soldering zone is higher than those for Regular. This may cause

damage to other components.

1. Recommended max past thickness > 0.25mm.

2. Devices can be cleaned using standard methods and aqueous

solvent.

3. Rework use standard industry practices.

4. Storage Environment : < 30

/ 60%RH

℃

Caution:

1. If reflow temperatures exceed the recommended profile, devices

may not meet the performance requirements.

2. Devices are not designed to be wave soldered to the bottom side

of the board.

A= SCF001-0603-R

B= SCF002-0603-R

C= SCF003-0603-R

D= SCF004-0603-R

E= SCF005-0603-R

F= SCF010-0603-R

G= SCF012-0603-R

H= SCF016-0603-R

I= SCF020-0603-R

Terminal pad material

Pure Tin

Soldering Characteristics

Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3

Temperature Rerating Chart

– I

Soldering Parameters

Temperature Rerating Curve

Average Time Current Curves

Material Specifications

Ramp-down

Preheat

Critical Zone

Time to peak temperature

(t 25℃ to peak)

25

Ramp-up

Time

Fault Current (A)

Ambient Temperature (

°C)