5

Figure 5. Recommended PCB mechanical cutouts and spacing

Assembly Recommendation

1. Insert

the

integrated

molded

lead-frame

DIP

sensor and all other electrical components into the

application PCB.

2. This sensor package is only qualified for wave-solder

process.

3. Wave-solder the entire assembly in a no-wash solder

process utilizing a solder fixture. The solder fixture

is needed to protect the sensor during the solder

process. The fixture should be designed to expose

the sensor leads to solder while shielding the optical

aperture from direct solder contact.

4. Place the lens onto the base plate. Care must be taken

to avoid contamination on the optical surfaces.

5. Remove the protective kapton tapes from the optical

aperture of the sensor and VCSEL respectively. Care

must be taken to keep contaminants from entering

the aperture.

6. Insert the PCB assembly over the lens onto the base

plate. The sensor package should self-align to the lens.

The optical position reference for the PCB is set by the

base plate and lens. The alignment guide post of the

lens locks the lens and integrated molded lead-frame

DIP sensor together. Note that the PCB motion due to

button presses must be minimized to maintain optical

alignment.

7. Optional: The lens can be permanently locked to the

sensor package by melting the lens’ guide posts over

the sensor with heat staking process.

8. Tune the laser output power from the VCSEL to meet

the Eye Safe Class I Standard as detailed in the LASER

Power Adjustment Procedure.

9. Install the mouse top case. There must be a feature in

the top case (or other area) to press down onto the

sensor to ensure the sensor and lenses are interlocked

to the correct vertical height.

Design considerations for improving ESD Performance

For

improved

electrostatic

discharge

performance,

typical creepage and clearance distance are shown in

the table below. Assumption: base plate construction as

per the

PixArt supplied IGES file and ADNS-6150, ADNS-

6160-001 or ADNS-6170-002 lens:

Lens

ADNS-6150

ADNS-6160-001

ADNS-6170-002

Creepage

12.0 mm

13.50 mm

20.30 mm

Clearance

2.1 mm

1.28 mm

1.28 mm

Note that the lens material is polycarbonate and

therefore, cyanoacrylate based adhesives or other

adhesives that may damage the lens should NOT be

used.

Optical center

Pin #1

7X 1.78

0.070

0.89

0.035

3.18

0.125

Lens interference

2.31

0.091

13.35

0.526

(2.78)

0.110

14.18

0.558

0.043

16X

0.028

0

0

PixArt Imaging Inc.

ADNS-7530 Integrated Molded Lead-Frame DIP Sensor

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PixArt Imaging Inc.