GRM552B11H102KA01D datasheet(216/221 Pages) MURATA

216 / 221 page

3. Soldering

(1) Limit of losing effective area of the terminations and

conditions needed for soldering.

(2) Flux Application

(3) Solder

Termination

Continued from the preceding page.

2. Mounting of Chips

Mechanical shock of the chip placer

When the positioning claws and pick-up nozzle are worn,

the load is applied to the chip while positioning is

concentrated in one position, thus causing cracks,

breakage, faulty positioning accuracy, etc.

Careful checking and maintenance are necessary to

prevent unexpected trouble.

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. Please set the suction nozzle's

bottom dead point on the upper surface of the board.

Thickness of adhesives applied

Keep thickness of adhesives applied (50-105

µm or more)

to reinforce the adhesive contact considering the

thickness of the termination or capacitor (20-70

µm) and

the land pattern (30-35

µm).

Continued on the following page.

Depending on the conditions of the soldering

temperature and/or immersion (melting time),

effective areas may be lost in some parts of the

terminations.

To prevent this, be careful in soldering so that any

possible loss of the effective area on the terminations

will securely remain at a maximum of 25% on all

edge length A-B-C-D-A of part with A, B, C, D, shown

in the Figure below.

An excessive amount of flux generates a large quantity of

flux gas, causing deteriorated solderability. So apply flux

thinly and evenly throughout. (A foaming system is

generally used for flow soldering.)

Flux containing too high a percentage of halide may

cause corrosion of the outer electrodes without sufficient

cleaning. Use flux with a halide content of 0.2% max.

Do not use strong acidic flux.

Do not use water-soluble flux.*

(*Water-soluble flux can be defined as non rosin type flux

including wash-type flux and non-wash-type flux.)

The use of Sn-Zn based solder will deteriorate the

reliability of the MLCC.

Please contact our sales representative or product

engineers on the use of Sn-Zn based solder in advance.

in section

Land Layout to Prevent Excessive Solder

Mounting Close to a Chassis

Mounting with Leaded Components

Mounting Leaded Components Later

Examples

to Be Avoided

Examples of

Improvements

by the Land

Division

Lead Wire Connected

to a Part Provided

with Lead Wires.

Chassis

Solder (Ground solder)

Adhesive

Base board

Land Pattern

Soldering Iron

Lead Wire of

Component to be

Connected Later.

Solder Resist

d1<d2

Solder Resist

Notice

215

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

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