GRM552B11H102KA01D datasheet(214/221 Pages) MURATA

214 / 221 page

Optimum Solder Amount when re-working Using a

Soldering Iron

Solder Amount

6. Correction with a Soldering Iron

When sudden heat is applied to the components by use

of a soldering iron, the mechanical strength of the

components will decrease because the extreme

temperature change causes deformations inside the

components.

In order to prevent mechanical damage to the

components, preheating is required for both the

components and the PCB board.

Preheating conditions, (The "Temperature of the

Soldering Iron Tip", "Preheating Temperature,"

"Temperature Differential" between iron tip and the

components and the PCB), should be within the

conditions of table 3.

It is required to keep the temperature differential between

the soldering Iron and the component's surface (

∆T) as

small as possible.

After soldering, do not allow the component/PCB to cool

down rapidly.

The operating time for the re-working should be as short

as possible. When re-working time is too long, it may

cause solder leaching, in turn causing a reduction of the

adhesive strength of the terminations.

--18/21/31

--32/42/43/

52/55

∆TV190D

∆TV130D

Part Number

Temperature

Differential

(

∆T)

Table 3

Continued from the preceding page.

7. Washing

Excessive output of ultrasonic oscillation during cleaning

causes PCBs to resonate, resulting in cracked chips or

broken solder. Take note not to vibrate PCBs.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

FUMING WHEN THE PRODUCT IS USED.

air

Atmosphere

150

°C min.

150

°C min.

Preheating

Temperature

350

°C max.

280

°C max.

Temperature

of Soldering

Iron tip

*Applicable for both Pb-Sn and Lead Free Solder.

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

For sizes smaller than Gpp18, the top of the solder fillet

should be lower than 2/3 of the thickness of the

component or 0.5mm whichever is smaller.

For sizes larger than Gpp21, the top of the solder fillet

should be lower than 2/3 of the thickness of the

component.

If the solder amount is excessive, the risk of cracking is

higher during board bending or under any other stressful

conditions.

A Soldering iron ø3mm or smaller should be used.

It is also necessary to keep the soldering iron from

touching the components during the re-work.

Solder wire with ø0.5mm or smaller is required for

soldering.

in section

!Caution

213

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

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10.12.20

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