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GRM552B11H102KA01D Folha de dados(PDF) 213 Page - Murata Manufacturing Co., Ltd. |
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GRM552B11H102KA01D Folha de dados(HTML) 213 Page - Murata Manufacturing Co., Ltd. |
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213 / 221 page ![]() The top of the solder fillet should be lower than the thickness of components. If the solder amount is excessively large, the risk of cracking is higher during board bending or under any other stressful conditions. Continued from the preceding page. Optimum Solder Amount for Flow Soldering 5. Flow Soldering When components are exposed to sudden heat, their mechanical strength can be decreased due to the extreme temperature changes which can cause flexing and result in internal mechanical damage, which will cause the parts to fail. Additionally, an excessively long soldering time or high soldering temperature results in leaching by the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact between electrodes and end termination. In order to prevent mechanical damage, preheating is required for both the components and the PCB board. Preheating conditions are shown in Table 2. It is required to keep temperature differential between the soldering and the components surface ( ∆T) as small as possible. When components are immersed in solvent after mounting, be sure to maintain the temperature difference between the component and solvent within the range shown in Table 2. Do not apply flow soldering to chips not listed in Table 2. G --18/21/31 ∆TV150D Part Number Temperature Differential Table 2 [Standard Conditions for Flow Soldering] [Allowable Soldering Temperature and Time] In the case of repeated soldering, the accumulated soldering time must be within the range shown above. ,,, ,,, ,,, Soldering Time (sec.) 260 270 250 240 230 010 20 30 Up to Chip Thickness Adhesive Recommended Conditions Peak Temperature Atmosphere Pb-Sn Solder 240-250 °C Air Lead Free Solder 250-260 °C N2 60-120 seconds 5 seconds max. ∆T Gradual Cooling Soldering Preheating 170 °C 150 °C 130 °C Time Temperature ( D) Peak Temperature ,,, ,,, ,,, Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Continued on the following page. in section !Caution 212 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. !Note C02E.pdf 10.12.20 |
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