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STM32F051C4 Folha de dados(PDF) 99 Page - STMicroelectronics

Nome de Peças STM32F051C4
Descrição Electrónicos  Low- and medium-density advanced ARM-based 32-bit MCU with 16 to 64 Kbytes Flash, timers, ADC, DAC and comm. interfaces
PDF  104 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F051C4 Folha de dados(HTML) 99 Page - STMicroelectronics

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Package characteristics
STM32F051x
100/105
Doc ID 022265 Rev 3
Figure 38.
UFQFPN32 recommended footprint
1.
Drawing is not to scale.
2.
Dimensions are expressed in millimeters.
7.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 20: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
●
TA max is the maximum ambient temperature in °C,
●
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
●
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
●
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.



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