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STM32F051C4 Folha de dados(PDF) 98 Page - STMicroelectronics

Nome de Peças STM32F051C4
Descrição Electrónicos  Low- and medium-density advanced ARM-based 32-bit MCU with 16 to 64 Kbytes Flash, timers, ADC, DAC and comm. interfaces
PDF  104 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F051C4 Folha de dados(HTML) 98 Page - STMicroelectronics

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STM32F051x
Package characteristics
Doc ID 022265 Rev 3
99/105
Figure 37.
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package outline (5 x 5)
1.
Drawing is not to scale.
2.
All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3.
There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in Table 13: Pin definitions.
Seating plane
ddd
C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0B8_ME
Bottom view
Table 71.
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
Dim.
mm
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
0.00
0.02
0.05
0
0.0008
0.0020
A3
0.152
0.006
b
0.18
0.23
0.28
0.0071
0.0091
0.0110
D
4.90
5.00
5.10
0.1929
0.1969
0.2008
D2
3.50
0.1378
E
4.90
5.00
5.10
0.1929
0.1969
0.2008
E2
3.40
3.50
3.60
0.1339
0.1378
0.1417
e
0.500
0.0197
L
0.30
0.40
0.50
0.0118
0.0157
0.0197
ddd
0.08
0.0031
1.
Values in inches are converted from mm and rounded to 4 decimal digits.



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