STW4141 datasheet(27/31 Pages) STMICROELECTRONICS

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Package outline and mechanical data

STw4141

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Package outline and mechanical data

Note:

Max mounted height is 1.12 mm. Based on a 0.28 mm ball pad diameter.

Solder paste is 0.15 mm thickness and 0.28 mm diameter.

TFBGA stands for Thin Profile Fine Pitch Ball Grid Array.

Thin profile: The total profile height (DIm A) is measured from the seating plane to the top of

the component.

A = 1.01 to 1.20 mm

Fine pitch < 1.00 mm pitch.

The tolerance of position that controls the location of the pattern of balls with respect to

datums A and B.

For each ball there is a cylindral tolerance zone eee perpendicular to datum C and located

on true position with respect to datums A and B as defined by e. The axis perpendicular to

datum C of each ball must lie within this tolerance zone.

The tolerance of position that controls the location of the balls within the matrix with respect

to each other. For each ball there is a cylindrical tolerance zone fff perpendicular to datum C

and located on true position as defined by e. The axis perpendicular to datum C of each ball

must lie within the tolerance zone.

Each tolerance zone fff in the array is contained entirely in the respective above eee zone

above.

The axis of each ball must be simultaneously in both tolerance zones.

Leadfree package according to JEDEC JESD-020-C

Table 10.

TFBGA 3x3x1.20 16 F4x4 0.50. Package code: L0 - JEDEC/EAIJ

Ref

Min.

Typ.

Max.

1.01

1.20 (

Note 1)

0.15

0.82

0.25

0.30

0.35

2.85

3.00

3.15

1.50

2.85

3.00

3.15

1.50

e0.50

ddd

0.85

0.08

eee

0.15

fff

0.05

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