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STW4141 Folha de dados(PDF) 25 Page - STMicroelectronics |
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STW4141 Folha de dados(HTML) 25 Page - STMicroelectronics |
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25 / 31 page ![]() Application information STw4141 24/30 4.7.1 PCB layout Figure 16 and Figure 17 show the PCB layout. All components are on the top side of the board. 4.7.2 TFBGA16 internal bumps access Pad centers are at 500 µm distance. Pad diameter is 275 µm. The distance between two adjacent pad edges is only 225 µm. We recommend a distance for lead-out signals from the center of pad matrix by 75 µm wide trace. Isolation distance in this case is 75 µm (see Figure 18 and Figure 19). Figure 18. TFBGA16 ball pad spacing and track parameters to internal pads Figure 16. Demoboard top layer Figure 17. Demoboard assembled with 22 µF output capacitor Grid dot distance : with A = 500 µm B = 275 µm C = 75 µm |
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