ADL5321ARKZ-R7 datasheet(10/16 Pages) AD

10 / 16 page

ADL5321

Rev. 0 | Page 10 of 16

BASIC LAYOUT CONNECTIONS

The basic connections for operating the ADL5321 are shown in

Figure 20.

Table 5 lists the required matching components. Capacitors

C1, C2, C3, C4, and C7 are Murata GRM155 series (0402 size)

and Inductor L1 is a Coilcraft 0603CS series (0603 size). For all

frequency bands, the placement of C3 and C7 is critical. From

2500 MHz to 2700 MHz, the placement of C1 is also important.

Table 6 lists the recommended component placement for

various frequencies.

A 5 V dc bias is supplied through L1 that is connected to RFOUT

(Pin 3). In addition to C4, 10 nF and 10 μF power supply

decoupling capacitors are also required. The typical current

consumption for the ADL5321 is 90 mA.

(2)

ADL5321

C6 10µF

C5 10nF

C41

L11

VCC

GND

RFIN

C21

C31

RFOUT

C11

C71

λ 2

1SEE TABLE 5 FOR FREQUENCY SPECIFIC COMPONENTS.

2SEE TABLE 6 FOR RECOMMENDED COMPONENT SPACING.

Figure 20. Basic Connections

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 21 shows the recommended land pattern for the ADL5321.

To minimize thermal impedance, the exposed paddle on the

SOT-89 package underside is soldered down to a ground plane

along with (GND) Pin 2. If multiple ground layers exist, they

should be stitched together using vias. For more information on

land pattern design and layout, refer to the AN-772 application

note, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

1.50mm

3.00mm

1.27mm

0.62mm

3.48mm

1.80mm

0.86mm

5.56mm

0.20mm

Figure 21. Recommended Land Pattern

Table 5. Recommended Components for Basic Connections

Frequency (MHz)

C1 (pF)

C2 (pF)

C3 (pF)

C4 (pF)

C7 (pF)

L1 (nH)

2500 to 2700

1.0

1.2

Open

9.5

3400 to 3850

1.2

1.0

9.5

Table 6. Matching Component Spacing

Frequency (MHz)

λ1 (mils)

λ2 (mils)

λ3 (mils)

λ4 (mils)

2500 to 2700

240

325

3400 to 3850

416

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