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R7KA8M2AFDCAM Folha de dados(PDF) 1 Page - Renesas Technology Corp |
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R7KA8M2AFDCAM Folha de dados(HTML) 1 Page - Renesas Technology Corp |
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1 / 295 page  RA8M2 Group Renesas Microcontrollers High-performance 1 GHz Arm® Cortex®-M85 core, 250 MHz Arm® Cortex®-M33 core, up to 1 MB code MRAM, and 2 MB SRAM with ECC. High-integration with Layer 3 Ethernet Switch Module, USB 2.0 High-Speed, CANFD, SDHI, I3C, Octal SPI, Decryption on-the-fly, and advanced analog. Integrated Renesas Security IP with cryptography accelerators, key management support, tamper detection and power analysis resistance in concert with Arm® TrustZone for integrated Secure element functionality. Features R01DS0438EJ0130 Rev.1.30 Feb 27, 2026 ■ Arm® Cortex®-M85 Core ● Armv8.1-M architecture profile ● Armv8-M Security Extension ● Maximum operating frequency: 1 GHz ● Memory Protection Unit (Arm MPU) – Protected Memory System Architecture (PMSAv8) – Secure MPU (MPU_S): 8 regions – Non-secure MPU (MPU_NS): 8 regions ● SysTick timer – Embeds two Systick timers: Secure and Non-secure instance – Driven by CPUCLK0 or MOCO divided by 8 ● CoreSight™ ETM-M85 ■ Arm® Cortex®-M33 core ● Armv8-M architecture profile ● Armv8-M Security Extension ● Maximum operating frequency: 250 MHz ● Memory Protection Unit (Arm MPU) – Protected Memory System Architecture (PMSAv8) – Secure MPU (MPU_S): 8 regions – Non-secure MPU (MPU_NS): 8 regions ● SysTick timer – Embeds two Systick timers: Secure and Non-secure instance – Driven by CPUCLK1 or MOCO divided by 8 ● CoreSight™ ETM-M33 ■ Memory ● Up to 1-MB MRAM ● 2 MB SRAM including 256 KB of CM85 TCM and 128 KB of CM33 TCM ● Up to 8-MB Flash for SiP product ■ Connectivity ● Serial Communications Interface (SCI) × 10, up to 60 Mbps ● I2C bus interface (IIC) × 3 ● I3C bus interface (I3C) ● Serial Peripheral Interface (SPI) × 2, up to 166 Mbps ● Octal Serial Peripheral Interface (OSPI) × 2, up to 333 MB/s ● USB 2.0 Full-Speed Module (USBFS) ● USB 2.0 High-Speed Module (USBHS) ● CAN with Flexible Data-rate (CANFD) × 2 ● Layer 3 Ethernet Switch Module (ESWM) – 2 × Gigabit Ethernet ● SD/MMC Host Interface (SDHI) × 2 ● Serial Sound Interface Enhanced (SSIE) × 2 ● Pulse Density Modulation Interface (PDMIF) ■ Analog ● 16-bit A/D Converter (ADC16H) × 2, up to 23 channels ● 12-bit D/A Converter (DAC12) × 2 ● High-Speed Analog Comparator (ACMPHS) × 4 ● Temperature Sensor (TSN) ■ Timers ● General PWM Timer 32-bit (GPT32) with High Resolution × 4 – 52 ps resolution in 300 MHz ● General PWM Timer 32-bit (GPT32) × 10 ● Low Power Asynchronous General Purpose Timer (AGT) × 2 ● Ultra-Low-Power Timer (ULPT) × 2 ■ Security and Encryption ● Renesas Security IP (RSIP-E50D) ● Arm® TrustZone® ● Privileged control ● Device lifecyle management ● Secure boot – Immutable first stage boot loader in OTP ● Decryption on-the-fly (DOTF) ● Pin function – Up to three tamper-resistant pins – Secure pin multiplexing ● HUK zeroization ■ System and Power Management ● Low power modes ● Battery backup function (VBATT) ● Realtime Clock (RTC) with calendar and VBATT support ● Event Link Controller (ELC) ● Data Transfer Controller (DTC) × 2 ● DMA Controller (DMAC) × 16 ● Power-on reset ● Programable Voltage Detection (PVD) with voltage settings ● Watchdog Timer (WDT) × 2 ● Independent Watchdog Timer (IWDT) ■ Human Machine Interface (HMI) ● Capture Engine Unit (CEU) ■ Multiple Clock Sources ● Main clock oscillator (MOSC) (8 to 48 MHz) ● Sub-clock oscillator (SOSC) (32.768 kHz) ● High-speed on-chip oscillator (HOCO) (16/18/20/32/48 MHz) ● Middle-speed on-chip oscillator (MOCO) (8 MHz) ● Low-speed on-chip oscillator (LOCO) (32.768 kHz) ● Clock trim function for HOCO/MOCO/LOCO ● PLL1/PLL2 ● Clock out support ■ General-Purpose I/O Ports ● 5-V tolerance, open drain, input pull-up, switchable driving ability ■ Operating Voltage ● Standard product – VCC/VCC2: 1.62 to 3.63 V ● SiP product – VCC/VCC2: 1.62 to 3.63 V/1.70 to 2.00 V ■ Operating Junction Temperature and Packages ● Tj = 0 °C to +95 °C – 289-pin BGA (12 mm × 12 mm, 0.65 mm pitch) – 224-pin BGA (11 mm × 11 mm, 0.65 mm pitch) – 303-pin BGA (15 mm × 15 mm, 0.8 mm pitch) – 169-pin BGA (7 mm × 7 mm, 0.5 mm pitch) ● Tj = -40 °C to +105 °C – 289-pin BGA (12 mm × 12 mm, 0.65 mm pitch) – 224-pin BGA (11 mm × 11 mm, 0.65 mm pitch) – 303-pin BGA (15 mm × 15 mm, 0.8 mm pitch) – 169-pin BGA (7 mm × 7 mm, 0.5 mm pitch) ● Tj = -40 °C to +125 °C – 289-pin BGA (12 mm × 12 mm, 0.65 mm pitch) – 224-pin BGA (11 mm × 11 mm, 0.65 mm pitch) – 176-pin HLQFP (24 mm × 24 mm, 0.5 mm pitch) Datasheet R01DS0438EJ0130 Rev.1.30 Feb 27, 2026 Page 1 of 295 |
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