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MPC8309CVMADFC Folha de dados(PDF) 53 Page - NXP Semiconductors |
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MPC8309CVMADFC Folha de dados(HTML) 53 Page - NXP Semiconductors |
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53 / 81 page ![]() MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 53 Package and Pin Listings Figure 44. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8309 MAPBGA Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. |
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