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STM32F101X6 Folha de dados(PDF) 28 Page - STMicroelectronics

Nome de Peças STM32F101X6
Descrição Electrónicos  Access line, advanced ARM-based 32-bit MCU with Flash memory, six 16-bit timers, ADC and seven communication interfaces
PDF  74 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F101X6 Folha de dados(HTML) 28 Page - STMicroelectronics

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Electrical characteristics
STM32F101xx
28/74
5.3
Operating conditions
5.3.1
General operating conditions
5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 8.
Operating conditions at power-up / power-down
Table 6.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 7.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
36
MHz
fPCLK1
Internal APB1 clock frequency
0
36
fPCLK2
Internal APB2 clock frequency
0
36
VDD
Standard operating voltage
2
3.6
V
VBAT
Backup operating voltage
1.8
3.6
V
P
D
Power dissipation at TA =
85 °C(1)
1.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 68).
LQFP100
434
mW
LQFP64
444
LQFP48
363
VFQFPN36
1110
TA
Ambient temperature
Maximum power dissipation
–40
85
°C
Low power dissipation(2)
2.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 68).
–40
105
°C
TJ
Junction temperature range
–40
105
°C
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
∞
µs/V
VDD fall time rate
20
∞



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