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STM32F101X6 Folha de dados(PDF) 61 Page - STMicroelectronics |
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STM32F101X6 Folha de dados(HTML) 61 Page - STMicroelectronics |
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61 / 74 page ![]() STM32F101xx Electrical characteristics 61/74 Figure 28. Typical connection diagram using the ADC 1. Refer to Table 41 for the values of RAIN, RADC and CADC. 2. CPARASITIC must be added to CAIN. It represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (3 pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 29 or Figure 30, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 29. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. VREF+ and VREF- inputs are available only on 100-pin packages. ai14139b STM32F101 VDD AINx IL±1 µA 0.6 V VT RAIN(1) CAIN VAIN 0.6 V VT RADC(1) 12-bit A/D conversion CADC(1) V REF+ STM32F101xx V DDA V SSA/V REF- 1 µF // 10 nF 1 µF // 10 nF ai14380 |
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