UCD3138064ARGCR datasheet(6/84 Pages) TI2

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UCD3138064A

SLUSCA5B – DECEMBER 2015 – REVISED JANUARY 2017

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Revision History

Table of Contents

Device Overview

......................................... 1

1.1

Features

.............................................. 1

1.2

Applications

........................................... 2

1.3

Description

............................................ 2

1.4

Functional Block Diagram

............................ 4

Revision History

......................................... 6

Device Options

........................................... 7

3.1

Device Comparison Table

............................ 7

Pin Configuration and Functions

..................... 8

4.1

Pin Diagrams

......................................... 8

Specifications

........................................... 11

5.1

Absolute Maximum Ratings

......................... 11

5.2

ESD Ratings

........................................ 11

5.3

Recommended Operating Conditions

............... 11

5.4

Thermal Information

................................. 11

5.5

Electrical Characteristics

............................ 12

5.6

Timing Characteristics

.............................. 15

5.7

PMBus/SMBus/I2C Timing

.......................... 16

5.8

Parametric Measurement Information

.............. 17

5.9

Typical Characteristics

............................. 19

Detailed Description

................................... 21

6.1

Overview

............................................ 21

6.2

ARM Processor

..................................... 21

6.3

Memory

.............................................. 21

6.4

Feature Description

................................. 22

6.5

Device Functional Modes

........................... 49

6.6

Memory

.............................................. 57

Applications, Implementation, and Layout

........ 61

7.1

Application Information

.............................. 61

7.2

Typical Application

.................................. 62

Device and Documentation Support

............... 75

8.1

Device Support

...................................... 75

8.2

Documentation Support

............................ 76

8.3

Receiving Notification of Documentation Updates

.. 77

8.4

Community Resources

.............................. 77

8.5

Trademarks

.......................................... 77

8.6

Electrostatic Discharge Caution

..................... 77

8.7

Glossary

............................................. 77

Mechanical, Packaging, and Orderable

Information

.............................................. 77

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (December 2015) to Revision A

Page

•

Deleted WQFN (40) from the Device Information table

.......................................................................... 3

•

Deleted the 3138064, 3138064A RMH (40 Pin) column from the Device Comparison Table

.............................. 7

•

Deleted the Product Selection Matrix table

....................................................................................... 7

•

Deleted the 40-Pin QFN RMH Package from the Pin Diagrams section

...................................................... 8

•

Deleted VQFN (RGZ) and WQFN (RMH) packages from the Thermal Information table

................................. 11

•

Added updated V33 slew rate values in the Device Grounding and Layout Guidelines section.

......................... 73

•

Changed the capacitor value from 0.22 µF to 2.2 µF.

.......................................................................... 73

•

Added BP18 decoupling requirements updated

................................................................................ 73

•

Added GPIO settings for unused pins

........................................................................................... 74

•

Changed New PCB Layout image

............................................................................................... 74

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