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BYW100 Folha de dados(PDF) 3 Page - STMicroelectronics |
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BYW100 Folha de dados(HTML) 3 Page - STMicroelectronics |
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3 / 5 page ![]() 5 10152025 0 10 20 30 40 50 60 70 80 90 100 110 Rth(°C/W) Rth(j-a) Rth(j-l) Lleads(mm) Fig. 3: Thermal resistance versus lead length. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0.10 1.00 10.00 50.00 IFM(A) Tj=25°C Tj=100°C Tj=100°C (Typical values) VFM(V) Fig. 5: Forward voltage drop versus forward current (maximum values). 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.01 0.10 1.00 Zth(j-a)/Rth(j-a) Single pulse δ = 0.1 δ = 0.2 δ = 0.5 tp(s) Fig. 4: Variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, epoxy FR4, e(Cu)=35 µm). 1 10 100 200 1 2 5 10 20 VR(V) C(pF) F=1MHz Tj=25°C Fig. 6: Junction capacitance versus reverse voltage applied (typical values). 1 10 100 0 50 100 150 trr(ns) IF=1.5A VR=30V 90% confidence Tj=100°C Tj=25°C dIF/dt(A/µs) Fig. 7: Reverse recovery time versus dIF/dt . 1 10 100 0.0 0.5 1.0 1.5 2.0 2.5 IRM(A) IF=1.5A VR=30V 90% confidence Tj=100°C Tj=25°C dIF/dt(A/µs) Fig. 8: Peak reverse recovery current versus dIF/dt. BYW100-200 3/5 |
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