5.9

PCB layout recommendations

Particular attention must be paid to the layout of the PCB tracks connected to the amplifier, load, and power

supply. The power and ground traces are critical as they must provide adequate energy and grounding for all

circuits. The best practice is to use short and wide PCB traces to minimize voltage drops and parasitic

inductance. In addition, to minimize parasitic impedance over the entire surface, a multi-via technique that

connects the bottom and top layer ground planes together in many locations is often used. The copper traces that

connect the output pins to the load and supply pins should be as wide as possible to minimize trace resistance.

5.10

Decoupling capacitor

In order to ensure op amp full functionality, it is mandatory to place a decoupling capacitor of at least 22 nF as

close as possible to the op amp supply pin. A good decoupling helps to reduce electromagnetic interference

impact.

5.11

Macromodel

Accurate macromodels of the TSV78x device are available on the STMicroelectronics’ website at: www.st.com.

These models are a trade-off between accuracy and complexity (that is, time simulation) of the TSV78x

operational amplifier. They emulate the nominal performance of a typical device within the specified operating

conditions mentioned in the datasheet. They also help to validate a design approach and to select the right

operational amplifier, but they do not replace on-board measurements.

TSV781, TSV782

Application information

DS14011 - Rev 7

page 22/34