G910_06 datasheet(2/10 Pages) GMT

2 / 10 page

Ver: 7.2

Jan 20, 2006

TEL: 886-3-5788833

http://www.gmt.com.tw

G910/G911

Global Mixed-mode Technology Inc.

Absolute Maximum Ratings

(Note 1)

Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V

Power Dissipation Internally Limited

(Note2)

Maximum Junction Temperature . . . . . . . . . . . . .150°C

Storage Temperature Range. . . . . -65°C

≤ TJ ≤+150°C

Reflow Temperature (soldering, 10sec) . . . . . . .260°C

Thermal Resistance Junction to Ambient, (θJA)

SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173°C/W(1)

SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . . 148°C/W(1)

µTO-92, TO-92 . . . . . . . . . . . . . . . . . . . . . . .159°C/W(1)

Thermal Resistance Junction to Case, (θJc)

SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..25°C/W

SOT-223 . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . 22°C/W

Note (1): See Recommended Minimum Footprint.

Operating Conditions

(Note 1)

Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . 4V ~ 6.5V

Temperature Range . . . . . . . . . . . . .-40°C

≤ TA ≤85°C

Electrical Characteristics

VIN =5V, IO = 600mA/250mA+, CIN=10µF, COUT =10µF. All specifications apply for TA = TJ = 25°C.[Note 3]

PARAMETER

CONDITION

MIN

TYP

MAX

UNIT

10mA < IO <600mA

Output Voltage

10mA < IO <250mA

3.234

3.3

3.366

Line Regulation

4V < VIN < 6V, IO = 10mA

---

10mA < IO < 600mA

---

Load Regulation

10mA < IO < 250mA

---

Quiescent Current

VIN = 5V

---

0.3

---

Ripple Rejection

fi = 120 Hz, 1VP-P, Io = 100mA

---

IO = 600mA

---

0.65

---

Dropout Voltage

IO = 250mA

---

0.25

---

VIN = 4.5V, mounted on SOT-89 recom-

mended minimum footprint

---

600

---

Output Current

Continuous Test

TA = 25°C, TJ < 125°C,

VOUT within ±2% (Note 2) VIN = 5.2V, µTO-92 & TO-92 package

0.53 inch leads soldered to PC Board

---

250+

---

Short Circuit Current

---

0.65

---

Current Limit

0.8

Over Temperature

---

145

---

°C

[

for

µTO-92 & TO-92 Package]

Note 1:

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are condi-

tions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and

test conditions see the Electrical Characteristics.

Note2:

The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,

and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this

dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G910 in

µTO-92, TO-92,

θJA is 159°C/W ;in the SOT-223 package is 148°C/W and SOT-89 package is 173°C/W (See Recom-

mended Minimum Footprint). The safe operation in TO-92 & µTO-92 package, it can see “Typical Performance Charac-

teristics” (Safe Operating Area).

Note3:

Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

Note4:

The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the regu-

lator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 100mV below its nominal value, dropout

voltage is affected by junction temperature, load cur-

rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input volt-

age. The measurement is made under conditions of low

dissipation or by using pulse techniques such that av-

erage chip temperature is not significantly affected.

Load Regulation

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that average chip tem-

perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.

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