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OP162GSZ Folha de dados(PDF) 15 Page - Analog Devices |
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OP162GSZ Folha de dados(HTML) 15 Page - Analog Devices |
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15 / 20 page ![]() Data Sheet OP162/OP262/OP462 Rev. H | Page 15 of 20 Figure 39. A Photo of a Nice Square Wave at the Output The network operates in parallel with the load capacitor, CL, and provides compensation for the added phase lag. The actual values of the network resistor and capacitor are empirically determined to minimize overshoot and maximize unity-gain bandwidth. Table 6 shows a few sample snubber networks for large load capacitors. Table 6. Snubber Networks for Large Capacitive Loads CLOAD RX CX < 300 pF 140 Ω 10 nF 500 pF 100 Ω 10 nF 1 nF 80 Ω 10 nF 10 nF 10 Ω 47 nF Higher load capacitance will reduce the unity-gain bandwidth of the device. Figure 40 shows unity-gain bandwidth vs. capacitive load. The snubber network does not provide any increase in bandwidth, but it substantially reduces ringing and overshoot, as shown between Figure 38 and Figure 39. Figure 40. Unity-Gain Bandwidth vs. CLOAD TOTAL HARMONIC DISTORTION AND CROSSTALK The OPx62 device family offers low total harmonic distortion making it an excellent choice for audio applications. Figure 41 shows a graph of THD plus noise figures at 0.001% for the OP462. Figure 42 shows the worst case crosstalk between two amplifiers in the OP462. A 1 V rms signal is applied to one amplifier while measuring the output of an adjacent amplifier. Both amplifiers are configured for unity gain and supplied with ±2.5 V. Figure 41. THD + N vs. Frequency Figure 42. Crosstalk vs. Frequency PCB LAYOUT CONSIDERATIONS Because the OP162/OP262/OP462 can provide gains at high frequency, careful attention to board layout and component selection is recommended. As with any high speed application, a good ground plane is essential to achieve the optimum performance. This can significantly reduce the undesirable effects of ground loops and I × R losses by providing a low impedance reference point. Best results are obtained with a multilayer board design with one layer assigned to ground plane. Use chip capacitors for supply bypassing, with one end of the capacitor connected to the ground plane and the other end connected within 1/8 inch of each power pin. An additional large tantalum electrolytic capacitor (4.7 µF to 10 µF) should be connected in parallel. This capacitor provides current for fast, large-signal changes at the device’s output; therefore, it does not need to be placed as close to the supply pins. 10 0% 100 90 50mV 1µs VS = 5V AV = 1 CL = 300pF RL = 10kΩ WITH SNUBBER: RX = 140Ω CX = 10nF CLOAD 10 7 8 9 5 6 4 3 2 1 0 10pF 100pF 1nF 10nF FREQUENCY (Hz) 0.010 0.001 0.0001 20 100 1k 10k 20k VS = ±2.5V AV = 1 VIN = 1.0V rms RL = 10kΩ BANDWIDTH: <10Hz TO 22kHz FREQUENCY (Hz) –40 –90 –80 –70 –60 –50 –140 –130 –120 –110 –100 20 100 1k 10k 20k � AV = 1 VIN = 1.0V rms (0dBV) RL = 10kΩ VS = ±2.5V |
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