OP162GSZ datasheet(13/20 Pages) AD

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Data Sheet

OP162/OP262/OP462

Rev. H | Page 13 of 20

and VIN swings up to 5 V, the output current will not exceed

30 mA. For single 5 V supply applications, resistors less than

169 Ω are not recommended.

Figure 32. Output Short-Circuit Protection

INPUT OVERVOLTAGE PROTECTION

The input voltage should be limited to ±6 V, or damage to the

device can occur. Electrostatic protection diodes placed in the

input stage of the device help protect the amplifier from static

discharge. Diodes are connected between each input as well as

from each input to both supply pins as shown in the simplified

equivalent circuit in Figure 30. If an input voltage exceeds either

supply voltage by more than 0.6 V, or if the differential input

voltage is greater than 0.6 V, these diodes energize causing

overvoltage damage.

The input current should be limited to less than 5 mA to

prevent degradation or destruction of the device by placing an

external resistor in series with the input at risk of being overdriven.

The size of the resistor can be calculated by dividing the maxi-

mum input voltage by 5 mA. For example, if the differential

input voltage could reach 5 V, the external resistor should be

5 V/5 mA = 1 kΩ. In practice, this resistor should be placed in

series with both inputs to balance any offset voltages created by

the input bias current.

OUTPUT PHASE REVERSAL

The OP162/OP262/OP462 are immune to phase reversal as

long as the input voltage is limited to ±6 V. Figure 27 shows the

output of a device with the input voltage driven beyond the

supply voltages. Although the device’s output does not change

phase, large currents due to input overvoltage could result,

damaging the device. In applications where the possibility of an

input voltage exceeding the supply voltage exists, overvoltage

protection should be used, as described in the previous section.

POWER DISSIPATION

The maximum power that can be safely dissipated by the

OP162/OP262/OP462 is limited by the associated rise in

junction temperature. The maximum safe junction temperature

is 150°C; device performance suffers when this limit is

exceeded. If this maximum is only momentarily exceeded,

proper circuit operation will be restored as soon as the die

temperature is reduced. Leaving the device in an “overheated”

condition for an extended period can result in permanent

damage to the device.

To calculate the internal junction temperature of the OPx62, use

the formula

TJ = PDISS × θJA + TA

where:

TJ is the OPx62 junction temperature.

PDISS is the OPx62 power dissipation.

θJA is the OPx62 package thermal resistance, junction-to-

ambient temperature.

TA is the ambient temperature of the circuit.

The power dissipated by the device can be calculated as

PDISS = ILOAD × (VS – VOUT)

where:

ILOAD is the OPx62 output load current.

VS is the OPx62 supply voltage.

VOUT is the OPx62 output voltage.

Figure 33 and Figure 34 provide a convenient way to determine

if the device is being overheated. The maximum safe power

dissipation can be found graphically, based on the package type

and the ambient temperature around the package. By using the

previous equation, it is a simple matter to see if PDISS exceeds the

device’s power derating curve. To ensure proper operation, it is

important to observe the recommended derating curves shown

in Figure 33 and Figure 34.

Figure 33. Maximum Power Dissipation vs. Temperature for

8-Lead Package Types

OPx62

VIN

VOUT

169

Ω

AMBIENT TEMPERATURE (

°C)

0.9

0.7

0.8

0.5

0.6

0.1

0.2

0.3

0.4

100

120

8-LEAD SOIC

8-LEAD MSOP

8-LEAD TSSOP

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