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TMP112BIDRLR Folha de dados(PDF) 30 Page - Texas Instruments

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Nome de Peças TMP112BIDRLR
Descrição Electrónicos  TMP112x High-Accuracy, Low-Power, Digital Temperature Sensors With SMBus and Two-Wire Serial Interface in SOT563 and X2SON Packages
PDF  41 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
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TMP112BIDRLR Folha de dados(HTML) 30 Page - Texas Instruments

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8.3.2 Layout Example
Serial Bus Traces
Pull-Up Resistors
Supply Bypass
Capacitor
Via to Power or Ground Plane
Via to Internal Layer
Supply Voltage
SCL
GND
ALERT
ADD0
V+
SDA
Ground Plane for
Thermal Coupling
to Heat Source
Heat Source
Figure 8-5. Layout Example (SOT563-6 package)
There are special considerations that need to be taken for the TMP112 X2SON package. These considerations
are due to the center pad being electrically connected to either address or alert (depending on the orderables
shown in Address and Alert Variant Device Target Address) and because of the dimensions of the package and
the pads. With the address option, the center pad can be directly connected with a trace on the same layer to
one of the 4 edge pins for setting the device address as shown in Figure 8-6.
TMP112, TMP112D
SBOS473L – MARCH 2009 – REVISED JULY 2024
www.ti.com
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Product Folder Links: TMP112 TMP112D



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