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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard

C1070_C0G_HV_FT-CAP_SMD • 2/28/2023

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

Peel Strength

8 mm

0.1 to 1.0 newton (10 to 100 gf)

12 and 16 mm

0.1 to 1.3 newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

Ao

Bo

°

T

°

s

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape

Maximum

Width (mm) Rotation ( °T)

8,12

20

16 – 200

10

Tape

Maximum

Width (mm) Rotation ( °S)

8,12

20

16 – 56

10

72 – 200

5

Typical Pocket Centerline

Typical Component Centerline

Figure 4 – Maximum Lateral Movement

0.5 mm maximum

0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum

1.0 mm maximum

16 mm Tape

Figure 5 – Bending Radius

R

R

Bending

Radius

Embossed

Carrier

Punched

Carrier