ORG4572-R01-TR2 datasheet(35/40 Pages) ETC

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Multi Spider - ORG4572 Datasheet

Revision 3.0

November 23, 2014

23. HANDLING INFORMATION

23.1. MOISTURE SENSITIVITY

ORG4572 modules are MSL 3 designated devices according to IPC/JEDEC J-STD-033B standard.

Module in sample or bulk package should be baked prior to assembly at 125°C for 48 hours.

23.2. ASSEMBLY

The module supports automatic pick-and-place assembly and reflow soldering processes.

Suggested solder paste stencil is 5 mil to ensure sufficient solder volume.

23.3. SOLDERING

Reflow soldering of the module always on component side (Top side) of the host PCB according to

standard IPC/JEDEC J-STD-020D for LGA SMD.

Avoid exposure of ORG4572 to face-down reflow soldering process.

FIGURE 20 – RECOMMENDED SOLDERING PROFILE

Referred temperature is measured on top surface of the package during the entire soldering process.

Suggested peak reflow temperature is 245°C for 30 sec. for Pb-Free solder paste.

Actual board assembly reflow profile must be developed individually per furnace characteristics.

Reflow furnace settings depend on the number of heating/cooling zones, type of solder paste/flux

used, board design, component density and packages used.

ORG4572-R01-TR2 Folha de dados(PDF) 35 Page - List of Unclassifed Manufacturers