FXLS8964AF datasheet(97/98 Pages) NXP

97 / 98 page

NXP Semiconductors

FXLS8964AF

3-Axis Low-g Accelerometer

Contents

General description ............................................ 1

Features and benefits .........................................1

Applications .........................................................2

3.1

Automotive security and convenience ............... 2

Ordering information .......................................... 2

4.1

Ordering options ................................................ 2

Block diagram ..................................................... 3

Pinning information ............................................ 4

6.1

Pinning ...............................................................4

6.2

Pinning description ............................................ 4

6.3

Orientation ......................................................... 6

Limiting values ....................................................6

Recommended operating conditions ................ 7

Mechanical characteristics ................................ 7

Electrical characteristics ....................................9

Temperature sensor characteristics ................12

I2C digital interface ...........................................12

12.1

I2C interface characteristics ............................ 12

12.1.1

General I2C operation ..................................... 14

12.1.2

I2C read/write operations ................................ 15

12.1.2.1 Single-byte read .............................................. 15

12.1.2.2 Multiple-byte read ............................................ 15

12.1.2.3 Single-byte write .............................................. 15

12.1.2.4 Multiple-byte write ............................................15

12.1.2.5 I2C data sequence diagrams ...........................16

SPI interface ...................................................... 16

13.1

General SPI operation .....................................16

13.2

SPI write operations with 3- or 4-wire mode .... 17

13.3

SPI read operations with 4-wire mode .............17

13.4

SPI read operations with 3-wire mode .............18

13.5

SPI timing specifications (4-wire mode and

3-wire hardwired modes) ................................. 19

13.6

SPI timing specifications (software enabled

3-wire mode) ....................................................20

Operating modes ...............................................21

15.1

INT_STATUS register (address 00h) ............... 31

15.2

TEMP_OUT register (address 01h) ................. 34

15.3

VECM_LSB register (address 02h) ................. 34

15.4

VECM_MSB register (address 03h) ................ 34

15.5

OUT_X_LSB, OUT_X_MSB, OUT_Y_LSB,

OUT_Y_MSB, OUT_Z_LSB, OUT_Z_MSB

registers (addresses 04h to 09h) .....................35

15.6

BUF_STATUS register (address 0Bh) ..............37

15.7

BUF_X_LSB, BUF_X_MSB, BUF_Y_LSB,

BUF_Y_MSB, BUF_Z_LSB, BUF_Z_MSB

(addresses 0Ch to 11h) ................................... 39

15.8

PROD_REV register (address 12h) .................41

15.9

WHO_AM_I register (address 13h) ................. 42

15.10

SYS_MODE register (address 14h) .................42

15.11

SENS_CONFIG1 register (address 15h) ......... 43

15.12

SENS_CONFIG2 register (address 16h) ......... 45

15.13

SENS_CONFIG3 register (address 17h) ......... 46

15.14

SENS_CONFIG4 register (address 18h) ......... 49

15.15

SENS_CONFIG5 register (address 19h) ......... 52

15.16

WAKE_IDLE_LSB register (address 1Ah) ....... 53

15.17

WAKE_IDLE_MSB register (address 1Bh) ...... 53

15.18

SLEEP_IDLE_LSB register (address 1Ch) ......54

15.19

SLEEP_IDLE_MSB register (address 1Dh) ..... 54

15.20

ASLP_COUNT_LSB, ASLP_COUNT_MSB

registers (addresses 1Eh to 1Fh) .................... 54

15.21

INT_EN register (address 20h) ........................56

15.22

INT_PIN_SEL register (address 21h) .............. 58

15.23

OFF_X, OFF_Y, OFF_Z registers

(addresses 22h to 24h) ................................... 59

15.24

BUF_CONFIG1 register (address 26h) ............60

15.25

BUF_CONFIG2 register (address 27h) ............62

15.26

ORIENT_STATUS register (address 28h) ........63

15.27

ORIENT_CONFIG register (address 29h) ....... 64

15.28

ORIENT_DBCOUNT register (address

2Ah) ................................................................. 65

15.29

ORIENT_BF_ZCOMP register (address

2Bh) ................................................................. 65

15.30

ORIENT_THS register (address 2Ch) ............. 66

15.31

Sensor Data Change Detection (SDCD)

registers ........................................................... 68

15.31.1 SDCD_INT_SRC1 register (address 2Dh) .......69

15.31.2 SDCD_INT_SRC2 register (address 2Eh) .......70

15.31.3 SDCD_CONFIG1 register (address 2Fh) .........72

15.31.4 SDCD_CONFIG2 register (address 30h) .........73

15.31.5 SDCD_OT_DBCNT register (address 31h) ..... 75

15.31.6 SDCD_WT_DBCNT register (address 32h) .....75

15.31.7 SDCD_LTHS_LSB register (address 33h) ....... 76

15.31.8 SDCD_LTHS_MSB register (address 34h) ...... 76

15.31.9 SDCD_UTHS_LSB register (address 35h) ...... 77

15.31.10 SDCD_UTHS_MSB register (address 36h) ..... 77

15.32

SELF_TEST_CONFIG1 register (address

37h) ..................................................................78

15.33

SELF_TEST_CONFIG2 register (address

38h) ..................................................................78

Application information ....................................80

16.1

System connections .........................................80

16.2

Recommendation for reading data registers .... 80

16.3

Typical application circuits ............................... 80

16.4

Power supply considerations ...........................83

Package outline .................................................83

17.1

Package description ........................................ 84

17.2

Lead dimension detail ......................................87

17.3

Burr specification ............................................. 87

Soldering information .......................................87

18.1

Printed circuit board layout and device

mounting .......................................................... 87

18.1.1

Overview of soldering considerations .............. 87

18.1.2

Halogen content .............................................. 87

Mounting information ....................................... 88

19.1

PCB mounting recommendations .................... 88

Glossary .............................................................89

References .........................................................90

Revision history ................................................ 91

Legal information ..............................................92

FXLS8964AF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.4 — 7 December 2021

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